IC200MDD845 GE VersaMax 16 Input 8 Relay Output Module
Manufacturer: GE Fanuc
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Part Number: IC200MDD845
Condition：New with Original Package
Product Type: Digital I/O Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC200MDD845 VersaMax Mixed Discrete I/O Module
Configured for discrete signal acquisition and high-power relay switching in VersaMax I/O backplane racks, the GE Fanuc IC200MDD845 (IC200MDD845 Mixed Discrete I/O Module) provides direct physical/electrical execution. The module integrates 16 digital inputs operating at 24 VDC positive logic along with 8 Form A relay outputs across a single backplane slot. Field-side logic signals and output contact circuits maintain 1500 V galvanic isolation from internal backplane logic circuitry.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC200MDD845 |
| Brand | GE Fanuc |
| Origin | USA |
| Weight | 0.159 kg |
| Dimensions | 133.4 x 85.9 x 69.1 mm |
| Operating Temp | 0 deg C to +60 deg C |
| Power Consumption | 270 mA at 5 VDC (backplane draw) |
| Input Channels | 16 discrete inputs (24 VDC nominal, positive logic) |
| Input Current | 2.0 to 5.5 mA ON, 0 to 0.5 mA OFF |
| Output Channels | 8 relay outputs (Form A) |
| Output Current Rating | 2.0 A resistive per point |
| Output Voltage Ranges | 5-30 VDC (2.0 A), 31-125 VDC (0.2 A), 5-265 VAC (2.0 A) |
| Circuit Isolation | 1500 V field-to-logic isolation |
| Status Indicators | Individual channel status LEDs, Module OK LED |
| Mounting Options | DIN-rail or direct panel mounting |
Backplane Communication and I/O Density Scaling
The module communicates via the VersaMax parallel backplane bus architecture, maintaining continuous input scanning and output latch updates without degrading bus transfer speed. High I/O density scaling allows mixed discrete signal processing in a single module footprint, reducing backplane carrier slot requirements. Additionally, onboard microcode maintains firmware flash compatibility with VersaMax CPUs, ensuring deterministic signal propagation times across multi-module expansion racks.
Frequently Asked Questions
Q: What is the backplane current draw requirement for the IC200MDD845 module?
A: The module draws 270 mA at 5 VDC directly from the VersaMax backplane carrier power rail during normal operational states.
Q: Are the Form A relay output channels individually isolated from one another?
A: Yes, each of the 8 relay output channels provides individual isolation, allowing independent switching across distinct AC and DC voltage potential groups.
Q: Does the IC200MDD845 support hot-swapping under powered rack conditions?
A: Module removal or insertion requires backplane power to be deactivated unless installed on a VersaMax hot-insert carrier designed specifically for field module replacement.
Field Installation Guidelines
Snap the IC200MDD845 module firmly onto its corresponding VersaMax carrier unit mounted on a standard 35 mm DIN rail or panel baseplate. Verify that the module locking mechanism fully engages with the carrier housing before applying power to the backplane.
Route all 24 VDC field input conductors and AC/DC output contact wiring through separate wire trays to prevent cross-talk coupling between high-voltage power loads and low-voltage DC logic signals. Maintain a minimum separation distance of 200 mm between AC load conductors and low-voltage sensor cabling. Ensure field power wiring connected to the relay terminals utilizes inductive load suppression devices (such as RC snubbers across AC coils or flyback diodes across DC coils) to suppress voltage transients during relay contact interruption.