IC670MDL640J GE Field Control Discrete Output Module
IC670MDL640J GE Field Control Discrete Output Module
IC670MDL640J GE Field Control Discrete Output Module
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IC670MDL640J GE Field Control Discrete Output Module

  • Manufacturer: GE Fanuc

  • Part Number: IC670MDL640J

  • Condition:New with Original Package

  • Product Type: Digital Output Modules

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

GE Fanuc IC670MDL640J Field Control Discrete Output Module

The GE Fanuc IC670MDL640J, also cataloged as the IC670MDL640 Discrete Output Module, operates as a dedicated hardware component for 24 VDC signal drive execution within Field Control distributed I/O systems. It converts internal logic commands from the Bus Interface Unit into physical output states to actuate external field devices.

Suffix Breakdown & Model Matrix

Part Number / Identifier Hardware Revision & Status Description
IC670MDL640 Base Field Control 32-Point Discrete Output Module Architecture
IC670MDL640J Specific Revision J Hardware Variant Identifier

Hardware Specifications

Parameter Specification
Model IC670MDL640J (Base Model: IC670MDL640)
Brand GE Fanuc
Origin USA
Weight 0.23 kg (0.50 lbs)
Dimensions 10.2 cm x 7.6 cm x 10.2 cm (4.0 in x 3.0 in x 4.0 in)
Operating Temp 0 deg C to +60 deg C (Storage: -40 deg C to +85 deg C)
Power Consumption 200 mA draw from Bus Interface Unit power supply
Rated Output Voltage 24 VDC Positive Logic (Operating range: 10-30 VDC)
Output Channels 32 discrete output points
On-State Voltage 18 VDC to 30 VDC
Off-State Voltage 0 VDC to 2 VDC
Output Current per Point 0.5 A maximum
Total Module Current 16 A maximum aggregate current
Response Time 1 ms typical
Galvanic Isolation 250 V continuous (1500 V for 1 min group-to-group/logic/frame ground)

Backplane Bus Communication Velocity & I/O Density Scaling

The IC670MDL640J expands total panel layout capacity by packaging 32 output channels into a single module space, advancing I/O density scaling across distributed node configurations. Integrated optical isolation shields the underlying Bus Interface Unit logic from destructive field transient voltages during high-current output switching. This isolated circuit structure ensures continuous backplane bus communication velocity and stable scan cycles when connected to host PACSystems RX3i or Series 90 platforms while maintaining firmware flash compatibility across backplane network interfaces.

Frequently Asked Questions

Q: How much current can the IC670MDL640J deliver simultaneously across all channels?

A: The module supplies up to 0.5 A on an individual point, with a maximum cumulative threshold of 16 A across all 32 output channels.

Q: What is the power requirement drawn directly from the local backplane interface?

A: The IC670MDL640J draws approximately 200 mA from the 5 VDC logic power supply provided by the Bus Interface Unit.

Q: What galvanic isolation boundaries does the IC670MDL640J establish between field and logic wiring?

A: Internal opto-isolators maintain a 250 V continuous (1500 V for 1 minute test duration) rating between user field terminals, local logic circuitry, and frame ground.

Field Installation Guidelines

  • De-energize primary backplane power and external 24 VDC field power sources prior to inserting or wiring the module.
  • Mount external inline fast-acting fuses on positive supply rails to safeguard module output circuits against field overcurrent conditions.
  • Observe correct DC voltage polarity when terminating wiring on the removable screw or barrier terminal block.
  • Maintain routing separation between 24 VDC field output wiring and low-voltage logic/communication cables to prevent noise cross-talk.
  • Verify that panel air circulation preserves an ambient operating temperature between 0 deg C and +60 deg C around the module frame.
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