{"product_id":"ic693chs397c-ge-series-90-30-cpu-baseplate","title":"IC693CHS397C GE Series 90-30 CPU Baseplate","description":"\u003ch2\u003eGE Fanuc IC693CHS397C Series 90-30 CPU Baseplate\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eGE Fanuc IC693CHS397C\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eIC693CHS397\u003c\/strong\u003e CPU Baseplate, operates as a dedicated hardware component for mechanical mounting and backplane bus signal distribution within Series 90-30 PLC systems. Serving as the main local chassis (Rack 0), the unit provides physical slots to interface a power supply, CPU module, and up to four discrete, analog, or option I\/O modules directly.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC693CHS397C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUnited States\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e1.05 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e265 x 130 x 142 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e270 mA at 5 VDC internal power consumption\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBase Model\u003c\/td\u003e\n\u003ctd\u003eIC693CHS397\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBaseplate Type\u003c\/td\u003e\n\u003ctd\u003eMain CPU Baseplate (Rack 0)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTotal Slots\u003c\/td\u003e\n\u003ctd\u003e5 active slots (1 Power Supply, 1 CPU\/Specialty, 4 I\/O)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSlot Assignment\u003c\/td\u003e\n\u003ctd\u003eUnnumbered left slot: Power Supply; Slot 1: CPU\/Specialty Module; Slots 2 to 5: I\/O or Option Modules\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMax Permitted per System\u003c\/td\u003e\n\u003ctd\u003e1 Main CPU Baseplate per system\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication Velocity \u0026amp; I\/O Density Scaling\u003c\/h3\u003e\n\u003cp\u003eThe IC693CHS397C houses a high-speed parallel backplane bus printed circuit board that carries address, data, and power lines across all card positions. By maintaining tight signal trace impedance, the backplane preserves high backplane bus communication velocity during high-frequency scan sweeps between the central processor in Slot 1 and field modules in Slots 2 through 5. The physical slot arrangement supports standardized I\/O density scaling across local expansion topologies.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Can the IC693CHS397C be configured as a secondary or remote expansion rack?\u003c\/p\u003e\n\u003cp\u003eA: No, the IC693CHS397\/CHS397C serves strictly as the main Rack 0 baseplate containing the central processor slot; expansion racks require dedicated expansion baseplates.\u003c\/p\u003e\n\u003cp\u003eQ: How does the IC693CHS397C receive operating power for backplane logic circuits?\u003c\/p\u003e\n\u003cp\u003eA: A Series 90-30 power supply module installs directly into the unnumbered left slot to convert incoming AC or DC mains voltage and inject 5 VDC and 24 VDC bus power.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eMount the baseplate firmly onto a grounded panel enclosure using four M4 screws through the corner mounting holes.\u003c\/li\u003e\n\u003cli\u003eConnect a heavy ground wire from the baseplate grounding stud directly to the enclosure main protective earth rail.\u003c\/li\u003e\n\u003cli\u003eVerify that module edge connectors align correctly with backplane slots before applying insertion force to avoid pin damage.\u003c\/li\u003e\n\u003cli\u003eLeave at least 75 mm of vertical clearance above and below the chassis for unimpeded natural thermal convection.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":44553701949539,"sku":"IC693CHS397C","price":120.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0583\/5246\/8067\/files\/35.1_b8080d72-cb09-4794-aab6-2b6b7e4d930c.jpg?v=1788515978","url":"https:\/\/www.autocontrolglobal.com\/products\/ic693chs397c-ge-series-90-30-cpu-baseplate","provider":"AutoControl Global","version":"1.0","type":"link"}