IC693CHS397L GE Fanuc 9-Slot Baseplate | New & Original Stock
Manufacturer: GE Fanuc
-
Part Number: IC693CHS397L
Condition：New with Original Package
Product Type: PLC Baseplates
-
Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC693CHS397L Series 90-30 PLC
The GE Fanuc IC693CHS397L, also cataloged as the IC693CHS397 9-Slot Baseplate, operates as a dedicated hardware component for module housing and backplane communication execution within Series 90-30 PLC platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC693CHS397L (Base Model: IC693CHS397) |
| Brand | GE Fanuc |
| Origin | United States |
| Weight | 1.1 kg (2.5 lbs) |
| Dimensions | 445 mm x 140 mm x 20 mm (17.5 in x 5.5 in x 0.8 in) |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | Derived from the installed Series 90-30 power supply module |
| Baseplate Type | 9-slot baseplate (1 dedicated power supply slot, 1 dedicated CPU slot, 7 I/O and option slots) |
| Mounting Orientation | Horizontal panel mounting only |
| Cooling | Natural convection |
| Tariff Code | 8537109070 |
Backplane Bus Communication Velocity and System Constraints
The IC693CHS397L utilizes an integrated high-speed parallel backplane bus to execute deterministic data transfer across the physical I/O infrastructure. Firmware flash compatibility across connected modules depends entirely on the processing metrics of the CPU inserted into slot 1. The electrical bus lines handle high I/O density scaling up to 7 distinct option modules, preventing impedance mismatches through structured track termination within the chassis. Power routing is localized, establishing solid bus communication velocity without external bridging cables inside a single rack footprint.
Frequently Asked Questions
Q: Can the IC693CHS397L baseplate be mounted vertically in high-density enclosures?
A: No. The chassis architecture relies on natural convection cooling and must be mounted horizontally. Vertical mounting alters the thermal dissipation profile, creating heat stagnation points that invalidate the 0 to 60 deg C operating specifications.
Q: Does this chassis support hot-swapping of I/O or CPU modules during active backplane operation?
A: No. The Series 90-30 backplane architecture does not feature live electronic insertion or removal capabilities. The system power supply must be completely de-energized before inserting or removing any module to prevent backplane bus damage or data corruption.
Q: How is the current load distributed across the backplane slots?
A: The physical backplane distributes voltage rails directly from the power supply module located in the leftmost slot. The combined current draw of the CPU and all 7 option modules must not exceed the maximum current output ratings specified for the installed power supply module.
Field Installation Guidelines
- Chassis Grounding: Secure the baseplate to a grounded metallic subpanel using internal star washers on the mounting screws to ensure low-impedance electrical contact. A dedicated copper grounding strap must run from the chassis ground terminal to the main enclosure earth ground bus.
- Spacing Requirements: Maintain a minimum clearance of 50 mm (2 inches) on all sides of the baseplate chassis to ensure unhindered natural convection airflow.
- Module Insertion: Align the printed circuit board edge connectors with the plastic chassis guides before applying structural pressure. Ensure the module locking mechanisms are fully engaged with the baseplate frame to prevent intermittent bus connection failures under high-vibration conditions.
- Wiring Segregation: Route all high-voltage AC and high-current DC field wiring through wire ducts separated from the low-voltage parallel backplane lines and adjacent communication cables to mitigate electromagnetic interference.