IC693CPU313V GE Fanuc Turbo CPU | New & Original Stock
Manufacturer: GE Fanuc
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Part Number: IC693CPU313V
Condition：New with Original Package
Product Type: CPU Processors
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC693CPU313V Series 90-30 Turbo CPU Baseplate Module
The GE Fanuc IC693CPU313V, also cataloged as the IC693CPU313 Turbo CPU Module, operates as a dedicated hardware component for boolean logic execution within Series 90-30 PLC platforms. The unit integrates a 10 MHz processing core directly into a 5-slot baseplate assembly, serving as the localized hardware foundation for application scanning, memory allocation, and backplane serial routing. It executes memory register scanning and serial data transport across local and remote I/O loops without external processing bridges.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC693CPU313V |
| Brand | GE Fanuc |
| Origin | United States |
| Weight | 0.82 kg (1.8 lbs) |
| Dimensions | 5-slot baseplate form factor |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 430 mA at +5 VDC (backplane load) |
| CPU Architecture | Intel 80188 / 80186-based Turbo Processor |
| Clock Speed | 10 MHz |
| Execution Speed | 0.6 ms per 1K Boolean instructions |
| User Program Memory | 12 KB |
| Register Memory (%R) | 1024 to 2048 words |
| Local I/O Slot Capacity | 5 slots total (1 dedicated for Power Supply, 4 for I/O and option modules) |
| Discrete I/O Capacity | Up to 160 points (base limit) / Up to 512 inputs and 512 outputs via expansion |
| Serial Interface | 1 x SNP/SNP-X slave port via power supply connector |
| Memory Storage Type | RAM (supports optional EPROM/EEPROM) |
PLC Backplane Bus Communication and Memory Scaling
The IC693CPU313V relies on specialized backplane bus communication velocity channels mapped across its 4 available I/O slots to achieve deterministic scan synchronization. The embedded architecture handles structured firmware flash compatibility constraints while managing native I/O density scaling up to 4 racks total (1 base rack + 3 expansion/remote racks). The internal memory map assigns designated registers for discrete global memory (%G, 1280 bits), internal coils (%M, 1024 bits), temporary outputs (%T, 256 bits), analog inputs (%AI, 64 words), and analog outputs (%AQ, 32 words) to maintain fixed memory addressing boundaries over Profinet / EtherNet/IP deterministic networks via option modules.
Frequently Asked Questions
Q: Does the IC693CPU313V baseplate assembly support hot-swapping of adjacent I/O or option modules?
A: No. The Series 90-30 baseplate architecture lacks the isolated logic gates required for live insertion. Power to the primary power supply module must be fully disconnected before removing or inserting any module into the 4 available baseplate slots to prevent physical backplane circuit failure.
Q: How is the physical serial interface accessed on this embedded CPU model?
A: The IC693CPU313V does not contain a physical serial port on the baseplate circuit board itself. The serial interface utilizes an internal link routed straight through the baseplate track to the D-shell connector found on the companion Series 90-30 power supply module, supporting SNP and SNP-X slave protocols.
Q: What are the application limits regarding floating-point mathematics and hardware interrupts?
A: This embedded processor executes basic integer instructions and standard shift registers. It does not provide hardware support for floating-point mathematical instructions, nor does it support hardware-driven or timed interrupt blocks within the application scan.
Field Installation Guidelines
- Baseplate Mounting Rigidness: Fasten the integrated 5-slot baseplate assembly directly to a zinc-plated or anodized steel backpanel inside the enclosure using standard M4 screws to ensure DIN-rail mounting stability and low-impedance electrical bonding.
- Power Supply Integration: Install a compatible Series 90-30 power supply module into the leftmost unnumbered slot of the baseplate. Verify that the interlocking top and bottom hooks seat fully to establish proper backplane voltage connection.
- Shield Grounding Infrastructure: Connect the central grounding terminal of the baseplate frame straight to the master protective earth (PE) busbar using an un-spliced, minimum 12 AWG copper wire to mitigate high-frequency electrical noise.
- Convection Cooling Clearances: Ensure a minimum clearance gap of 50 mm (2 inches) is maintained on all sides of the baseplate housing. Route field wiring ducts clear of the ventilation slots to maintain an operating ambient boundary below 60 deg C.