{"product_id":"ic693cpu363-dl-ge-fanuc-cpu-module-new-original-stock","title":"IC693CPU363-DL GE Fanuc CPU Module | New \u0026 Original Stock","description":"\u003ch2\u003eGE Fanuc IC693CPU363 Series 90-30 CPU Module\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eGE Fanuc IC693CPU363-DL\u003c\/strong\u003e serves as the primary \u003cstrong\u003eIC693CPU363\u003c\/strong\u003e CPU Module utilized to execute user-defined control logic across Series 90-30 platforms. Driven by an embedded 80386EX microprocessor operating at a clock speed of 25 MHz, this single-slot processing unit manages up to 2048 discrete input points and 2048 discrete output points. The engine evaluates boolean contacts at a typical scan rate of 0.22 ms per 1K of logic, using 240 KB of integrated memory storage split between volatile RAM and non-volatile Flash structures to maintain deterministic loop execution.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC693CPU363-DL \/ IC693CPU363\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc (Emerson)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUnited States\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e1.00 lbs (0.45 kg)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard Series 90-30 module slot size\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e890 mA @ 5 VDC backplane current load\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMicroprocessor\u003c\/td\u003e\n\u003ctd\u003e80386EX (25 MHz clock speed, 32-bit architecture)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eUser Register Memory\u003c\/td\u003e\n\u003ctd\u003e240K Bytes total (RAM and Flash storage)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDiscrete I\/O Capacity\u003c\/td\u003e\n\u003ctd\u003e2048 inputs, 2048 outputs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTypical Scan Rate\u003c\/td\u003e\n\u003ctd\u003e0.22 ms per 1K of boolean logic\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFloating Point Math\u003c\/td\u003e\n\u003ctd\u003eYes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInterrupt Support\u003c\/td\u003e\n\u003ctd\u003ePeriodic subroutine feature\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSerial Interfaces\u003c\/td\u003e\n\u003ctd\u003e3 serial ports (including RS-485 via power supply connection)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eEthernet Port\u003c\/td\u003e\n\u003ctd\u003eN\/A (not supported natively on board)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStorage Temperature\u003c\/td\u003e\n\u003ctd\u003e-40 to 85 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eProfinet \/ EtherNet\/IP Deterministic Networks and I\/O Density Scaling\u003c\/h3\u003e\n\u003cp\u003eThe IC693CPU363 processing core maintains fixed communication cycle periods required to structure variable arrays before data mapping. When bridging data from this legacy architecture to contemporary Profinet or EtherNet\/IP deterministic networks, the CPU coordinates asynchronous register packages via coprocessor links. This layout manages predictable data throughput during expansive I\/O density scaling phases. The internal memory mapping logic preserves strict firmware flash compatibility across standard Series 90-30 hardware branches, preventing bit collision during high-speed parallel backplane logic updates.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eQ: Can the IC693CPU363-DL module be hot-swapped while the baseplate is powered?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eA: No.\u003c\/strong\u003e The Series 90-30 architecture lacks hot-swap backplane trace suppression. Extracting or inserting the primary processor while 5 VDC logic power is applied will corrupt the volatile RAM register table, generate hardware bus faults, or cause micro-arc damage across the gold-plated backplane interface pins.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eQ: How is the volatile memory retained on this module during an unpowered facility shutdown?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eA: The module relies on the lithium battery assembly located within the adjacent baseplate power supply module.\u003c\/strong\u003e This battery backup loop maintains the 240 KB RAM contents. Long-term program safety can also be achieved by burning the finalized logic configuration into the non-volatile onboard Flash memory segment.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eChassis Engagement:\u003c\/strong\u003e Isolate all system power before insertion. Fit the top pivot hook of the CPU housing into slot 1 of the primary CPU baseplate (directly adjacent to the power supply), rotate the module downwards until the parallel interface plug sets into the backplane, and tighten the lower faceplate screw.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSerial Port Shielding:\u003c\/strong\u003e When utilizing the onboard serial channels for peripheral connections, use dual-shielded twisted-pair cables. Ground the cable braid entirely at the chassis grounding bracket to bypass stray electro-magnetic interference from the processing logic.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThermal Management:\u003c\/strong\u003e Maintain a minimum 2-inch clear perimeter above and below the chassis assembly. Ensure ambient cabinet currents stay below 60 deg C to prevent localized thermal stagnation from inducing microprocessor clock drift or premature battery depletion.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":44217266634851,"sku":"IC693CPU363-DL","price":420.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0583\/5246\/8067\/files\/374_cc73038f-81c2-455a-8d6c-2a33d8ecb4d9.jpg?v=1779870306","url":"https:\/\/www.autocontrolglobal.com\/products\/ic693cpu363-dl-ge-fanuc-cpu-module-new-original-stock","provider":"AutoControl Global","version":"1.0","type":"link"}