{"product_id":"ic693cpu363-ge-fanuc-cpu-module-new-original-stock","title":"IC693CPU363 GE Fanuc CPU Module | New \u0026 Original Stock","description":"\u003ch2\u003eGE Fanuc IC693CPU363 Series 90-30 CPU Module\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eGE Fanuc IC693CPU363-DK\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eIC693CPU363\u003c\/strong\u003e CPU Module, operates as a dedicated hardware component for executing user-defined control logic within Series 90-30 PLC platforms. Driven by an 80386EX microprocessor operating at a clock speed of 25 MHz, this single-slot execution engine manages up to 2048 discrete inputs, 2048 discrete outputs, and 240 KB of register user memory. The module performs real-time deterministic evaluation of boolean contacts at a typical scan rate of 0.22 ms per 1K of logic, maintaining control sequence timing over local and expansion chassis backplanes.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC693CPU363-DK \/ IC693CPU363\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUnited States\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e1.00 lbs (0.45 kg)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eSingle-slot Series 90-30 chassis module\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e890 mA @ 5 VDC backplane current load\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMicroprocessor\u003c\/td\u003e\n\u003ctd\u003e80386EX (25 MHz clock speed)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eUser Memory\u003c\/td\u003e\n\u003ctd\u003e240K Bytes total (RAM and Flash storage)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDiscrete I\/O Capacity\u003c\/td\u003e\n\u003ctd\u003e2048 discrete inputs, 2048 discrete outputs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTypical Scan Rate\u003c\/td\u003e\n\u003ctd\u003e0.22 ms per 1K of boolean logic\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSerial Interface\u003c\/td\u003e\n\u003ctd\u003e3 serial ports (including RS-485 via power supply interface)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eEthernet Port\u003c\/td\u003e\n\u003ctd\u003eNot Available (N\/A)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStorage Temperature\u003c\/td\u003e\n\u003ctd\u003e-40 to 85 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRelative Humidity\u003c\/td\u003e\n\u003ctd\u003e5% to 95% non-condensing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eProfinet \/ EtherNet\/IP Deterministic Networks and I\/O Density Scaling\u003c\/h3\u003e\n\u003cp\u003eThe IC693CPU363 processing core maintains fixed communication cycle periods required to structure variable arrays before data mapping. When bridging data from this legacy architecture to contemporary Profinet or EtherNet\/IP deterministic networks, the CPU coordinates asynchronous register packages via coprocessor links. This layout manages predictable data throughput during expansive I\/O density scaling phases. The internal memory mapping logic preserves strict firmware flash compatibility across standard Series 90-30 hardware branches, preventing bit collision during high-speed parallel backplane logic updates.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eQ: Can the IC693CPU363-DK module be hot-swapped while the baseplate is powered?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eA: No.\u003c\/strong\u003e The Series 90-30 architecture lacks hot-swap backplane trace suppression. Extracting or inserting the primary processor while 5 VDC logic power is applied will corrupt the volatile RAM register table, generate hardware bus faults, or cause micro-arc damage across the gold-plated backplane interface pins.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eQ: How is the volatile memory retained on this module during an unpowered facility shutdown?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eA: The module relies on the lithium battery assembly located within the adjacent baseplate power supply module.\u003c\/strong\u003e This battery backup loop maintains the 240 KB RAM contents. Long-term program safety can also be achieved by burning the finalized logic configuration into the non-volatile onboard Flash memory segment.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eChassis Engagement:\u003c\/strong\u003e Isolate all system power before insertion. Fit the top pivot hook of the CPU housing into slot 1 of the primary CPU baseplate (directly adjacent to the power supply), rotate the module downwards until the parallel interface plug sets into the backplane, and tighten the lower faceplate screw.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSerial Port Shielding:\u003c\/strong\u003e When utilizing the onboard serial channels for peripheral connections, use dual-shielded twisted-pair cables. Ground the cable braid entirely at the chassis grounding bracket to bypass stray electro-magnetic interference from the processing logic.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThermal Management:\u003c\/strong\u003e Maintain a minimum 2-inch clear perimeter above and below the chassis assembly. Ensure ambient cabinet currents stay below 60 deg C to prevent localized thermal stagnation from inducing microprocessor clock drift or premature battery depletion.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":44217264177251,"sku":"IC693CPU363DK","price":420.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0583\/5246\/8067\/files\/310._a6f19c47-064f-4d0d-9e3f-11b966139212.jpg?v=1779869687","url":"https:\/\/www.autocontrolglobal.com\/products\/ic693cpu363-ge-fanuc-cpu-module-new-original-stock","provider":"AutoControl Global","version":"1.0","type":"link"}