IC693PWR331D GE Fanuc Series 90-30 Datasheet & Technical Manual
IC693PWR331D GE Fanuc Series 90-30 Datasheet & Technical Manual
IC693PWR331D GE Fanuc Series 90-30 Datasheet & Technical Manual
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IC693PWR331D GE Fanuc Series 90-30 Datasheet & Technical Manual

  • Manufacturer: GE Fanuc

  • Part Number: IC693PWR331D

  • Condition:New with Original Package

  • Product Type: Power Supply Modules

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

GE Fanuc IC693PWR331D Series 90-30 Power Supply Module

The GE Fanuc IC693PWR331D, also cataloged as the IC693PWR331 Power Supply Module, operates as a dedicated hardware component for converting direct current voltage inputs into regulated backplane and auxiliary distribution power within GE Fanuc Series 90-30 PLC platforms.

Hardware Specifications

Parameter Specification
Model IC693PWR331D
Brand GE Fanuc
Origin United States
Weight 0.6 kg (1 lbs 5.0 oz)
Dimensions 7.6 cm x 12.7 cm x 12.7 cm (3.0 in x 5.0 in x 5.0 in)
Operating Temp 0 to 60 deg C (derates above 50 deg C to 4 A at 60 deg C)
Power Consumption 50 W DC at full load
Nominal Input Voltage 24 VDC
Input Voltage Range 18 to 30 VDC (startup), 12 to 30 VDC (operating)
+5 VDC Output Current Maximum 6 A (30 W)
+24 VDC Relay Output 24 to 28 VDC, maximum 5 W
+24 VDC Isolated Output 21.5 to 28 VDC, maximum 20 W
Maximum Backplane Current Approximately 6 A
Overvoltage Protection 6.4 to 7 VDC on +5 VDC rail
Overcurrent Protection 7 A maximum, short-circuit protection
Mounting Location Leftmost slot of baseplate only
Cooling Natural convection
Tariff Code 8504409520

Industrial Control & Drive Technical Attributes

The Revision D hardware execution optimizes backplane bus communication velocity and stability across the Series 90-30 chassis. By engineering reinforced PCB copper traces and upgrading internal capacitors to a 105 deg C rating, the module suppresses voltage ripple during periods of high I/O density scaling. This design safeguards deterministic networks (such as Genius or Profibus networks interfacing via adjacent modules) from data corruption induced by power sag or thermal heat dissipation anomalies within the backplane bus infrastructure.

Frequently Asked Questions

Q: Can the IC693PWR331D module be installed in any available slot on the baseplate? A: No. The module is mechanically and electrically keyed exclusively for the leftmost slot of the Series 90-30 baseplate. Inserting or forcing the module into any other I/O slot will cause physical damage to the backplane connectors and render the power supply inoperable.

Q: How does the power supply handle ambient operational temperatures exceeding 50 deg C? A: The module undergoes internal temperature derating when ambient conditions exceed 50 deg C. The maximum available output capacity on the +5 VDC rail reduces linearly from 6 A down to 4 A as the temperature rises to its upper limit of 60 deg C.

Q: Does this power supply module support hot-swapping under live backplane conditions? A: No. Primary input power must be disconnected before installing or removing the module. Attempting to service the power supply while the backplane is energized risks causing electrical arcing, module damage, or unexpected CPU faults.

Field Installation Guidelines

  • Slot Orientation: Align the module with the dedicated leftmost slot on the baseplate. Verify that the plastic hooks on the top and bottom of the module seat securely into the baseplate notches before tightening the retaining screws.
  • Wiring and Grounding: Use a minimum of 14 AWG (2.1 mm²), 60 deg C copper wire for the 24 VDC input connections. Connect a low-impedance ground wire directly from the module's frame ground terminal to the main panel enclosure earth ground to maximize common-mode noise rejection.
  • Convection Clearance: Maintain at least 100 mm of clear vertical space above and below the baseplate assembly. Do not obstruct the ventilation louvers on the top or bottom of the module housing, as the unit relies entirely on natural convection cooling.
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