IC693TCM302 GE Fanuc Series 90-30 TCM Datasheet Technical Manual
Manufacturer: GE Fanuc
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Part Number: IC693TCM302
Condition：New with Original Package
Product Type: Temperature Control Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC693TCM302 Series 90-30 Temperature Control Module
The GE Fanuc IC693TCM302, also cataloged as the IC693TCM302 Temperature Control Module, operates as a dedicated hardware component for closed-loop temperature regulation within Series 90-30 PLC platforms. The hardware combines multi-channel analog front-end scanning with local microprocessor-driven PID execution to process high-resolution thermocouple sensor data. By calculating proportional-integral-derivative control loops directly on the module substrate, the board updates dedicated pulse-width modulation (PWM) solid-state outputs without expanding execution cycle latencies on the master controller rack.
Suffix Breakdown & Model Matrix
- IC693TCM302: Base catalog number specifying the 8-channel input, 8-channel open-collector output temperature control module architecture.
- Suffix A / B: Sequential factory hardware revisions. Variant suffixes designate minor iterations in the internal printed circuit board traces and optimization of component layouts to improve electromagnetic shielding profiles around the analog-to-digital converter matrix.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC693TCM302 |
| Brand | GE Fanuc (Emerson Automation) |
| Origin | United States |
| Weight | 0.11 kg (0.24 lbs) net board / 0.31 kg packaged gross mass |
| Dimensions | 132 mm x 36 mm x 100 mm |
| Operating Temp | 0 to +55 deg C continuous execution (storage rated from -40 to +85 deg C) |
| Power Consumption | 150 mA to 250 mA @ 5 VDC drawn from the internal backplane bus rails |
| Module Type | Temperature Control Module (TCM) with localized PID loop engine |
| Input Channels | 8 thermocouple input lines (Types J, K, T, E, R, S, B, N) |
| Output Channels | 8 open-collector outputs configured for direct PWM loop tracking |
| External Power Supply | 18 to 36 VDC (handles up to 2.5 A transient inrush currents) |
| Output Voltage Range | 18 to 30 VDC |
| Loop Current Load | 100 mA maximum continuous per output point |
| Measurement Resolution | 14-bit analog-to-digital converter architecture |
| Input Impedance Limit | 30 Ohms maximum continuous sensor path resistance |
| Off-State Leakage | 0.1 mA maximum across rated operating limits |
| Overload Circuit Cutout | Triggers typically at 700 mA with a 2 ms minimum filter window |
| Internal Safety Protection | Galvanic isolation at 1500 VDC field-to-logic; 2 A, 125 V internal subminiature fuse |
| Baseplate Interface | Single-slot format, installs onto standard Series 90-30 PLC backplanes |
| Status Visual Indicators | LEDs for Power, Run, Fault, Short, and 8 discrete output status indicators |
Firmware Flash Compatibility and I/O Density Scaling
The GE Fanuc IC693TCM302 relies on its onboard processing core to execute independent digital filter equations and cold junction compensation (CJC) via a built-in thermistor interface. The hardware assembly links to the master rack using internal memory allocation profiles that operate under conditions regulated by backplane bus communication velocity licenses.
To achieve precise parameters when connecting distributed nodes into modern supervisory networks, such as Profinet / EtherNet/IP deterministic networks, the module handles multi-channel processing locally. This configuration supports expanded I/O density scaling profiles by summarizing 8 sensor inputs and 8 actuator outputs into a single backplane slot allocation, eliminating the need to transmit high-frequency raw microvolt signals across remote communication bridges.
Frequently Asked Questions
Q: Does the IC693TCM302 support live insertion or hot-swapping functionality while the baseplate is energized?
A: No. The internal logic structures and electrical pin assignments on the Series 90-30 backplane are not hot-swappable. Pulling or inserting the module while power is active can induce voltage spikes across the 5 VDC logic rail, causing immediate component damage or triggering system error states on the CPU.
Q: How does the internal safety framework respond to a field-side thermocouple open-wire failure?
A: The input monitoring circuit continually samples terminal continuity. If a thermocouple lead snaps or detaches, the internal logic flags an open-circuit state, illuminates the localized front panel Fault LED, and forces the assigned PID loop to execute its pre-configured safety fault state.
Q: What are the cooling and installation location restrictions for this temperature control module?
A: The module must be positioned on a standard Series 90-30 CPU baseplate or an expansion rack. It can occupy any standard I/O slot position, excluding the dedicated CPU slot, provided ambient temperatures inside the enclosure maintain a steady profile between 0 and 55 deg C under continuous loading.
Field Installation Guidelines
- Completely isolate and lock out all primary AC utility feeds and auxiliary DC loop power sources prior to working on the PLC rack components.
- Guide the module along the chassis slots, checking that the rear multi-point bus connectors are parallel to the backplane sockets before applying pressure.
- Secure the top and bottom mechanical lock mechanisms to verify a solid electrical ground between the module frame and the chassis rail.
- Terminate all thermocouple extension wires directly onto the terminal blocks using shielded twisted-pair pairs, making sure the shield terminates exclusively at the panel earth point.
- Keep all low-voltage thermocouple input lines separated by at least 30 cm from high-voltage AC lines, motor leads, or drive output cables to prevent electromagnetic noise coupling.