IC694ACC310A GE Fanuc PACSystems RX3i Datasheet & Manual
Manufacturer: GE Fanuc
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Part Number: IC694ACC310A
Condition：New with Original Package
Product Type: PLC Rack Accessories
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC694ACC310A Blank Slot Filler Module
The GE Fanuc IC694ACC310A, also cataloged as the IC694ACC310 Blank Slot Filler Module, operates as a dedicated hardware component for slot insulation and mechanical stabilization within PACSystems RX3i baseplate assemblies.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC694ACC310A / IC694ACC310 |
| Brand | GE Fanuc (Emerson Automation) |
| Origin | USA |
| Weight | 0.11 kg (0.25 lbs) |
| Dimensions | 135.0 mm x 38.0 mm x 127.0 mm (5.3 in x 1.5 in x 5.0 in) |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | None (0.0 A backplane current draw) |
| Module Type | Blank slot filler module / Slot cover |
| System Line | PACSystems RX3i |
| Compatible Baseplates | 7, 12, and 16-slot standard baseplates |
| Compatible Expansion | 5 and 10-slot expansion / remote baseplates |
| I/O Count | None |
| Communication Ports | None |
| Status LED Indicators | None |
| Hot-Swap Function | Removal and insertion under power is allowed |
| Structural Protections | Vibration prevention and environmental debris shield |
Backplane Bus Communication Velocity and Protective Shielding
The GE Fanuc IC694ACC310A requires zero active processing resources and does not alter the backplane bus communication velocity of adjacent modules. The physical housing installs into any unused single-slot opening to maintain the structural continuity of the PACSystems RX3i chassis. By blocking exposed backplane connector traces, the module serves as an environmental shield that blocks conductive particulate matter and reduces fluid ingress hazards. This passive configuration supports unrestricted I/O density scaling across remote or main multi-slot racks without requiring internal firmware flash compatibility updates or programming allocations.
Frequently Asked Questions
Q: Are there any specific firmware configurations or software addressing steps needed when adding this module to a live baseplate? A: No software programming or hardware configuration is required. The module contains no electronics or physical communication interfaces, meaning it does not register on the RX3i system I/O map and remains transparent to the host CPU controller.
Q: Can this module be physically inserted or extracted while the local chassis power supply is turned on? A: Yes. The module is fully rated for insertion and removal under power. Because it draws zero current from the +5 VDC or +24 VDC backplane rails, seating or removing the module will not cause electrical arcing, current spikes, or data disruptions on the active parallel bus.
Field Installation Guidelines
- Baseplate Slot Engagement: Align the top and bottom structural tabs of the filler module with the plastic card guides of the chosen empty slot on the RX3i baseplate. Push the module firmly inward until the mechanical locking latch engages securely with the chassis frame.
- Mechanical Ingress Mitigation: Install these filler units in all unpopulated slots within the rack assembly. This practice ensures that internal airflow patterns remain optimized for thermal heat dissipation across nearby processing or power modules and keeps airborne dust off open backplane pins.
- Vibration Stabilizing Procedures: Verify that the captive fasteners or integrated plastic clips are completely secured against the sheet metal rail. Proper engagement prevents mechanical vibration from creating resonant noise inside high-density control enclosures.