IC694MDL660CA-BC GE Fanuc PACSystems RX3i Datasheet & Technical Manual
Manufacturer: GE Fanuc
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Part Number: IC694MDL660CA-BC
Condition：New with Original Package
Product Type: Digital Output Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC694MDL660CA-BC PACSystems RX3i Series
The GE Fanuc IC694MDL660CA-BC, also cataloged as the GE Fanuc IC694MDL660 Digital Output Module, operates as a dedicated hardware component for field device execution within PACSystems RX3i platform networks.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC694MDL660CA-BC |
| Brand | GE Fanuc |
| Origin | United States |
| Weight | 0.2 kg (0 lbs 8.0 oz) |
| Dimensions | 3.8 cm x 14.0 cm x 14.0 cm (1.5 in x 5.5 in x 5.5 in) |
| Operating Temp | 0 to +60 deg C |
| Power Consumption | 130 mA (from backplane logic side) |
| Output Type | Positive logic DC output |
| Number of Points | 32 outputs |
| Rated Voltage | 12/24 VDC |
| Voltage Range | 12-24 VDC (+20%, -15%) |
| Output Current | 0.5 A per point (continuous), 4.0 A max per group at 50 deg C |
| ON Voltage Drop | <= 1.2 V DC |
| OFF Leakage Current | <= 1 mA |
| Response Time | ON <= 2 ms, OFF <= 2 ms |
| Protection | Electronic short-circuit protection (per group) |
| Isolation | 1500 VAC field-to-logic, 500 VAC between groups |
| Storage Temperature | -20 to +70 deg C |
| Humidity | 5-95% RH, non-condensing |
| Certifications | UL, CE, CSA compliant |
Industrial Control and Drives Logic Synchronization
The 32-point sourcing card interfaces directly with the host chassis assembly, resolving state adjustments to scale real-time I/O density scaling requirements. The hardware aligns with the standard backplane bus communication velocity Licences to transmit state data under 2 ms processing windows. This digital block implements strict electronic short-circuit monitoring per group, validating electrical boundaries independently of active firmware flash compatibility processes. Built-in discrete filters work in tandem with regional data paths to sustain Profinet / EtherNet/IP deterministic networks, absorbing line disturbances while protecting internal logic arrays from inductive kickback.
Frequently Asked Questions
Q: What are the backplane current constraints and loading limits when setting up multiple 32-point output modules?
A: The card draws 130 mA from the internal logic bus. When populating high-density racks, engineers must calculate cumulative milliamp draw values to prevent over-loading the chassis power supply module.
Q: Is this digital output module hot-swap compatible within the PACSystems RX3i rack platform?
A: Yes, the module supports hot-swap physical insertion and extraction within active RX3i chassis slots. However, removing a module while running breaks active field loops instantly, which can trigger downline interlock faults across the broader industrial network.
Field Installation Guidelines
- Chassis Engagement and Alignment: Align the top and bottom hooks of the module with the chosen RX3i slot guides. Swing the module down firmly into the backplane connectors until the top latch engages completely, then tighten the retaining screws.
- Field Wiring and Group Isolation: Wire the 32 outputs across the 4 independent groups of 8 points each. Verify that external 12/24 VDC power supplies comply with the specified +20% / -15% voltage bounds to preserve nominal switching levels.
- Shield Grounding and Cable Separation: Group all DC field lines inside separate wire ways away from high-voltage AC lines or motor driver circuits. Connect external cable shields to the primary enclosure ground rail to prevent induced noise spikes on the signal lines.