IC694MDL730 GE PACSystems RX3i 12-24 VDC Output Module
Manufacturer: GE Fanuc
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Part Number: IC694MDL730
Condition：New with Original Package
Product Type: Digital Output Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC694MDL730 PACSystems RX3i Output Module
The GE Fanuc IC694MDL730, also cataloged as the IC694MDL730 Output Module, operates as a dedicated hardware component for discrete signal execution within PACSystems RX3i platforms. Configured to drive external control elements such as contactors, solenoids, and status indicators, this single-slot module channels logic-level backplane commands directly into physical output switching states. It provides high-density current switching capability up to 2 A per channel with an output voltage tolerance of 12-24 VDC (+20%, -15%) and incorporates 1500 V AC isolation to shield internal backplane logic from field-side electrical disturbances.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC694MDL730 |
| Brand | GE Fanuc / Emerson |
| Origin | USA |
| Weight | 0.45 kg (1.00 lbs) |
| Dimensions | Standard RX3i single-slot footprint |
| Operating Temp | 0 to 60 deg C (32 to 140 deg F) |
| Power Consumption | 55 mA at 5 VDC (backplane load) |
| Output Capacity | 8 points (discrete solid-state / driver outputs) |
| Output Voltage Range | 12-24 VDC (+20%, -15%) |
| Output Current | 2 A per point max |
| Inrush Current | 9.4 A per 10 ms max |
| Isolation Voltage | 1500 V AC between field outputs and backplane logic |
| Response Time | 2 ms max (turn-on / turn-off) |
Industrial Control & Backplane Integration
The IC694MDL730 establishes direct signal routing over the RX3i backplane bus, supporting high backplane bus communication velocity and deterministic cycle execution. The internal output circuits maintain rapid physical switching profiles with a maximum response latency of 2 ms, allowing the central processor to maintain precise timing across output points. Built-in thermal and overcurrent protection measures safeguard internal board traces during momentary inrush spikes up to 9.4 A, while firmware flash compatibility across the PACSystems RX3i system line ensures unified rack configuration and predictable I/O density scaling.
Frequently Asked Questions
Q: Can the IC694MDL730 output channels withstand high inrush currents from inductive field loads?
A: Yes, each output channel is rated to handle transient inrush currents up to 9.4 A for a duration of 10 ms during inductive load energization.
Q: Is hot-swapping supported for the IC694MDL730 in an active RX3i baseplate?
A: Insertion or removal of the IC694MDL730 must be performed only when the rack power supply and field circuit power are fully de-energized to prevent backplane bus communication errors and contact damage.
Q: What is the switching response latency of the IC694MDL730 output channels?
A: The module executes output state changes within a maximum turn-on and turn-off response time of 2 ms.
Field Installation Guidelines
- Power Disconnection: Fully shut off main supply power to the RX3i rack and isolate all external 12-24 VDC field output wiring prior to installing or servicing the module.
- Inductive Load Suppression: Install external flyback diodes or RC suppression networks directly across inductive loads (such as DC solenoid coils) to absorb voltage spikes and prolong hardware circuit life.
- Cable Shielding & Routing: Separate high-current output lines from sensitive low-voltage analog and communication wiring, keeping conductors in dedicated wireways to minimize cross-talk and electromagnetic noise.