IC695ACC400-AA GE Fanuc Rack Filler | New & Original Stock
Manufacturer: GE Fanuc
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Part Number: IC695ACC400-AA
Condition：New with Original Package
Product Type: Chassis Accessories
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC695ACC400-AA PACSystems RX3i Series
The GE Fanuc IC695ACC400-AA, also cataloged as the GE Fanuc IC695ACC400 Rack Filler / Slot Cover, operates as a dedicated hardware component for protecting unused slots within PACSystems RX3i PLC backplane platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695ACC400-AA |
| Brand | GE Fanuc (General Electric) |
| Origin | USA |
| Weight | 0.1 kg (Module weight) / 1.5 kg package weight |
| Dimensions | 30 mm x 130 mm x 20 mm |
| Operating Temp | 0 to +60 deg C |
| Power Consumption | Passive component (0 W) |
| System Compatibility | PACSystems RX3i PLC racks |
| Material | Industrial-grade flame-retardant plastic with conductive coating |
| Mounting Type | Snap-in installation into rack slot |
| Storage Temperature | -40 to +85 deg C |
| Humidity | 5-95% RH, non-condensing |
| Certifications | UL, CE, CSA approved |
Industrial Control and Drives Thermal and Chassis Dynamics
As a mechanical component within the modular system, this slot cover scales the physical environment properties of the layout. The hardware block alters structural air routing patterns to govern continuous thermal heat sink dissipation profiles of adjacent processing modules, while the integrated conductive coating enforces local electromagnetic compatibility (EMC). This implementation works directly with firmware flash compatibility and backplane communication safety requirements by ensuring that ambient noise propagation remains below execution thresholds and preventing cross-talk across high-velocity RX3i bus networks.
Frequently Asked Questions
Q: Does this rack filler draw any logic current from the active RX3i backplane bus power supply?
A: No, this is a passive mechanical accessory containing no internal copper circuit traces or active logic gates. It features zero power consumption metrics and has no impact on backplane bus current calculations or power supply capacities.
Q: Can this blank slot cover be inserted or removed while the surrounding RX3i PLC system is fully powered and operating?
A: Yes, because the assembly features no electrical interfaces or solid-state electronics, hot-swap physical insertion or removal can occur at any time without causing signal distortion, bus failure, or data register faults on adjacent running modules.
Field Installation Guidelines
- Slot Insertion Mechanics: Slide the component straight into the empty chassis position along the built-in plastic card guides. Push firmly until the top and bottom snap-in fasteners click into place, locking the cover flush against the active modules.
- Airflow Management and Clearances: Install slot covers over every unused rack position immediately to prevent forced-convection short-circuiting. Unprotected chassis openings disrupt targeted cabinet air distribution and cause rapid thermal stress in nearby CPUs.
- Electrostatic Ground Contact: Ensure the chassis guide rails remain clean and clear of debris prior to pushing the module in. The conductive surface treatment requires structural surface alignment with the metal rack cage to maximize ground shielding parameters.