IC695CHS007 GE PACSystems RX3i Universal Backplane
Manufacturer: GE Fanuc
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Part Number: IC695CHS007
Condition：New with Original Package
Product Type: Universal Backplanes
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC695CHS007 Universal Backplane
The GE Fanuc IC695CHS007, also cataloged as the IC695CHS007 Universal Backplane, operates as a dedicated hardware component for high-speed module interconnection and power distribution within GE PACSystems RX3i platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695CHS007 |
| Brand | GE Fanuc / Emerson Automation |
| Origin | USA |
| Weight | 1.11 kg (2.44 lbs) |
| Dimensions | Approx. 317.5 x 177.8 x 50.8 mm (12.5 x 7 x 2 in) |
| Operating Temp | 0 deg C to +60 deg C |
| Power Consumption | Internal draw: 600 mA at 3.3 VDC, 240 mA at 5 VDC |
| Slot Count | 7 Slots total (Slot 0 for IC695 Power Supply; Slots 1-6 for I/O and option modules) |
| Power Distribution | +3.3 VDC, +5 VDC, +24 VDC auxiliary via TB1 terminal strip |
| Bus Architecture | Dual-bus implementation (High-speed PCI Bus and Serial Bus) |
| Enclosure Requirement | IP20 / NEMA Type 1 minimum (IP54 recommended) |
| Mounting Orientation | Horizontal rack or panel mount |
Backplane Bus Communication Velocity and Density
The IC695CHS007 housing incorporates dual backplane bus lines to maintain deterministic data flow and firmware flash compatibility across legacy and modern control structures. The backplane integrates a high-speed PCI bus structure alongside a serial bus channel, enabling high-density RX3i CPUs and option modules to exchange process data with ultra-low latency. Furthermore, the backplane infrastructure isolates logic signals while distributing regulated +3.3 VDC, +5 VDC, and auxiliary +24 VDC rails to connected cards. This hardware arrangement guarantees seamless cross-module backplane bus communication velocity while preventing signal attenuation across all seven card slots.
Frequently Asked Questions
Q: Can Series 90-30 I/O modules be installed directly into the IC695CHS007 backplane?
A: Yes, the IC695CHS007 supports both RX3i and legacy Series 90-30 I/O and option modules. However, the system must use appropriate slot assignments, reserving Slot 0 specifically for an IC695 power supply module to manage internal bus power conversion.
Q: What are the restrictions regarding hot-swapping modules on this backplane?
A: The IC695CHS007 supports hot-swapping for standard RX3i modules without removing backplane power. Field technicians must ensure that high-speed communication cards complete pending bus cycles before extraction to prevent transient faults on the dual PCI/serial bus network.
Field Installation Guidelines
Technicians must mount the IC695CHS007 horizontally to maintain passive thermal convection cooling across installed cards. Maintain a minimum installation clearance of 102 mm (4.0 in) on all four sides of the backplane rack.
Secure the unit within an enclosure rated at least IP20/NEMA Type 1, using IP54 or higher for harsh industrial environments. Terminate external power connections at Terminal Strip (TB1) using 14 to 22 AWG field wiring for isolated +24 VDC power lines.
Establish a low-impedance safety ground by connecting a dedicated earth wire directly to the integrated internal grounding bar and earth grounding terminal. Ensure grounding paths adhere strictly to single-point termination rules to prevent ground loop noise from corrupting high-speed PCI bus signals.