IC695CHS012-CA GE Fanuc 12-Slot Backplane | New & Original Stock
Manufacturer: GE Fanuc
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Part Number: IC695CHS012CA
Condition：New with Original Package
Product Type: GE Fanuc PACSystems RX3i
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC695CHS012-CA PACSystems RX3i Universal Backplane
The GE Fanuc IC695CHS012-CA, also cataloged as the IC695CHS012CA Universal Backplane (12-slot), serves as the primary IC695CHS012 Universal Backplane (12-slot) utilized to execute physical module mounting and dual-bus signal routing across PACSystems RX3i platforms. The hardware establishes the mechanical structural frame and parallel routing tracks necessary to link processing units, power supply adapters, and network interface cards into a unified local bus configuration.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695CHS012-CA |
| Brand | GE Fanuc |
| Origin | USA |
| Weight | 2.5 kg |
| Dimensions | 17.5 x 7 x 6 inches |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | Passive backplane structure (Internal current draw not specified) |
| Total Slots | 12 slots (Slot 0 reserved for power supply, Slot 1 for CPU/NIU, Slots 2-11 for I/O) |
| Backplane Type | Dual bus: PCI and Serial |
| Module Compatibility | PACSystems RX3i modules and legacy Series 90-30 modules |
| Power Supply Support | IC695PSD040, IC695PSD140, IC695PSA040, IC695PSA140 |
| Storage Temperature | -40 to 85 deg C |
| Humidity Range | 5% to 95% non-condensing |
| Mounting Type | Standard 19-inch rack or panel mounting |
| Certifications | [Information Not Specified] |
Industrial Control and Drive Attributes
The backplane architecture integrates a localized dual-bus routing infrastructure comprised of a high-speed PCI bus and a standard serial bus designed to manage high I/O density scaling. This configuration ensures backplane bus communication velocity Licences are maintained across all 12 slots while preserving mechanical and electrical backward compatibility with legacy modules. The design maintains high isolation boundaries between the parallel signaling tracks to suppress data corruption during continuous, concurrent transactions over Profinet / EtherNet/IP deterministic networks, maintaining structural firmware flash compatibility across active processing nodes.
Frequently Asked Questions
Q: What are the strict slot assignment constraints governing module allocation on the IC695CHS012-CA?
A: Slot 0 is strictly reserved for the installation of the primary power supply module (e.g., IC695PSD040 or IC695PSA040). Slot 1 is dedicated to the system CPU or Network Interface Unit (NIU). Slots 2 through 11 handle standard I/O modules, communication modules, or legacy Series 90-30 cards.
Q: Does this 12-slot backplane hardware provide internal infrastructure for power supply redundancy?
A: No. The physical track layout and power rail traces of this specific chassis model do not support redundant power configurations.
Q: Can legacy Series 90-30 modules utilize the PCI bus channels directly?
A: Legacy Series 90-30 modules communicate strictly over the integrated serial bus traces. Only native PACSystems RX3i modules can engage the high-speed PCI bus pins available on the backplane connector rows.
Field Installation Guidelines
- Chassis Mounting Stability: Fasten the backplane into a standard 19-inch rack enclosure or directly onto a low-impedance panel backplate using the specified mounting screw holes. Ensure the chassis is level and structurally secure against vibration profiles before loading modules.
- Grounding Requirements: Establish a low-impedance copper ground connection from the dedicated ground terminal on the backplane chassis directly to the primary panel earth ground bar. A solid ground connection is necessary to limit electrical noise on the dual bus lines.
- Module Seating Protocol: Insert modules straight down along the slot guides to prevent bending the connector pins on the backplane. Ensure the module mechanical lock mechanisms are fully engaged with the frame to maintain electrical contact.
- Thermal Management Clearances: Ensure unobstructed air flow around the unit. Maintain a minimum vertical clearance spacing above and below the backplane assembly to prevent localized heat accumulation within the rack.