IC695CHS012-CA GE Fanuc PACSystems RX3i Datasheet & Manual
Manufacturer: GE Fanuc
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Part Number: IC695CHS012-CA
Condition：New with Original Package
Product Type: PLC Racks
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC695CHS012 Universal Backplane
The GE Fanuc IC695CHS012-CA, also cataloged as the IC695CHS012 12-Slot Universal Backplane, operates as a dedicated hardware component for module housing and electrical interconnection within PACSystems RX3i platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695CHS012-CA / IC695CHS012 |
| Brand | GE Fanuc (Emerson Automation) |
| Origin | USA |
| Weight | 1.81 kg (4.00 lbs) |
| Dimensions | 482.6 mm x 292.1 mm x 190.5 mm (19.0 in x 11.5 in x 7.5 in) |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | Max. module load: 600 mA @ 3.3 VDC, 240 mA @ 5 VDC |
| Total Heat Dissipation | 3.18 W |
| Number of Slots | 12 module slots (supports CPUs, power supplies, and I/O) |
| Bus Structure | Dual-Bus Design (PCI Bus and Serial Bus) |
| Module Compatibility | PCI I/O, Serial I/O, and legacy Series 90-30 I/O modules |
| Hot-Swap Function | Hot Module Insertion and Removal supported (except for CPUs) |
| System Expansion | Expansion and remote backplane connections supported |
| Mechanical Protection | Shipped with factory-installed protective blank filler modules |
Backplane Bus Communication Velocity and I/O Density Scaling
The GE Fanuc IC695CHS012-CA utilizes an integrated dual-bus architecture containing both a high-speed PCI bus and a standard serial bus to dictate backplane bus communication velocity. This parallel physical layer configuration permits the simultaneous deployment of high-throughput RX3i modules and legacy Series 90-30 I/O modules inside a single chassis. The dual-bus traces execute deterministic data synchronization across all 12 slots, enabling full system I/O density scaling up to the maximum load rating of 1.98 W on the 3.3 VDC rail and 1.2 W on the 5 VDC rail without compromising signal propagation times or violating firmware flash compatibility rules.
Frequently Asked Questions
Q: Does this universal backplane allow hot-swapping for all module categories? A: The backplane electrical bus supports Hot Module Insertion and Removal (RIUP) for standard I/O and option modules. However, central processing units (CPUs) are strictly excluded from this capability; host power must be fully isolated before inserting or extracting any CPU module to prevent bus errors or circuit damage.
Q: How are expansion and remote chassis routed from this primary backplane? A: Local expansion chassis interface directly using standard RX3i I/O expansion cables connected to bus transmitter modules. For longer distance remote racks, custom-length cables must be paired with an external terminating resistor at the physical end of the communication chain to maintain correct line impedance.
Field Installation Guidelines
- Enclosure Mechanical Mounting: Secure the backplane onto the rear panel or cabinet sub-plate using heavy-duty industrial fasteners. Ensure the chassis conforms to standard 19-inch rack mounting layouts and maintains appropriate clearing boundaries for uniform ventilation.
- Grounding and Noise Suppression: Attach a thick copper grounding strap from the dedicated grounding lug on the backplane frame directly to the main cabinet earth ground bar. This connection path shunts high-frequency noise away from the active PCI and serial bus data lines.
- Filler Module Maintenance: Keep the factory-provided blank slot filler modules locked into all unpopulated slots. This structural barrier maintains proper internal airflow dynamics for thermal heat dissipation and prevents airborne metallic dust from building up on unshielded backplane pins.