IC695CPE302 GE Fanuc PACSystems RX3i Datasheet & Technical Manual
Manufacturer: GE Fanuc
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Part Number: IC695CPE302-AAA
Condition：New with Original Package
Product Type: CPU Processors
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC695CPE302 RX3i PACSystems CPU Module
Configured for high-speed deterministic real-time control in RX3i PACSystems platforms, the GE Fanuc IC695CPE302 (IC695CPE302 CPU Module) provides direct physical/electrical execution. It handles dual-bus backplane data routing, orchestrates industrial Ethernet communication networks, and manages non-volatile application memory execution. The module features an integrated multi-port Gigabit Ethernet switch, an isolated RS-232 serial port, and a USB 2.0 interface to process control and remote I/O loops.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695CPE302 |
| Brand | GE Fanuc Emerson |
| Origin | United States |
| Weight | 0.51 kg (1.13 lbs) |
| Dimensions | Standard RX3i single-slot module width |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 1 Amp at +5 VDC, 1 Amp at +3.3 VDC, 0.5 Amps at +24 VDC |
| Processor Speed | 1.1 GHz |
| User Memory | 2 MB user memory (5 MB non-volatile backed by Energy Pack) |
| Program Storage | SRAM, Flash |
| Network Interfaces | 1 x Ethernet interface with 2-port 10/100/1000 Mbps switch |
| Serial Interfaces | 1 x RS-232 isolated serial port |
| USB Interface | Standard 2.0 |
| Protocol Support | SRTP, Modbus TCP/IP, OPC UA, PROFINET, DNP3, Modbus RTU |
| System Backplane | RX3i Dual-Bus Architecture (PCI and Serial) |
| Status Indicators | 8 LEDs |
PLC Deterministic Backplane Bus Communication
The IC695CPE302 operates directly within the RX3i dual-bus backplane structure, providing deterministic communication synchronization between the CPU and attached I/O modules. By bridging high-speed PCI Express bus communication velocities with standard serial backplane traffic, the controller executes synchronous real-time scans across local and remote I/O chassis. It maintains sub-millisecond task synchronization profiles and prevents data collisions or transmission latencies during dense I/O scaling operations. Firmware flash compatibility ensures the embedded communication stack can be updated without replacing physical hardware components.
Frequently Asked Questions
Q: What are the restrictions regarding the installation slot for the IC695CPE302 within the RX3i chassis?
A: The IC695CPE302 must be installed exclusively in Slot 1 or Slot 2 of the RX3i Universal Backplane. This placement is mandatory to establish direct physical connection to the high-speed PCIe bus lines required for CPU processing operations.
Q: How is memory retained during a complete loss of system input power?
A: The CPU utilizes an external, battery-less IC695ACC400 Energy Pack to provide non-volatile data retention. Upon power loss, the Energy Pack provides sufficient auxiliary current to write active SRAM runtime data directly into the onboard Flash memory.
Q: Does this module support hot-swapping or Bumpless Insertion while the backplane is powered?
A: No, the CPU module itself cannot be hot-swapped. System power must be fully isolated and turned off before removing or inserting the IC695CPE302 controller to prevent permanent damage to the dual-bus backplane logic gates.
Field Installation Guidelines
- Chassis Power Isolation: Verify that all upstream AC or DC input power sources to the RX3i power supply module are completely disconnected before installing or pulling the CPU card.
- Slot Allocation Verification: Ensure the target universal backplane slot is either Slot 1 or Slot 2. Clean the backplane connector pins of any airborne particulates before insertion.
- ESD Protection Protocols: Technicians must wear a properly grounded electrostatic discharge (ESD) wrist strap attached to the bare metal PE (Protective Earth) rail of the industrial enclosure during handling.
- Shielding and Grounding: Standard industrial noise mitigation practices require the RX3i rack to be bonded to a low-impedance ground plane. Ensure all communication cable shields (Ethernet, RS-232) are grounded at one end to prevent ground loops.
- Energy Pack Connection: Securely mount the IC695ACC400 Energy Pack and plug its power harness into the dedicated capacitor port on the CPU housing prior to system initialization.