IC695CPU315-AA GE PACSystems RX3i CPU Module Redundancy Controller
Manufacturer: GE Fanuc
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Part Number: IC695CPU315-AA
Condition：New with Original Package
Product Type: Programmable Automation Controllers
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE IC695CPU315-AA PACSystems RX3i CPU Module
Configured for Specific Technical Task in System/Network Name, the GE IC695CPU315-AA (IC695CPU315 CPU Module) provides direct physical/electrical execution. The hardware operates as a central processing unit executing control logic and data manipulation over the embedded RX3i backplane infrastructure.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695CPU315-AA |
| Brand | GE Fanuc / Emerson |
| Origin | USA |
| Weight | 0.8 kg (module only) / 2.8 kg with packaging |
| Dimensions | 241 x 194 x 152 mm |
| Operating Temp | 0 to +60 deg C |
| Power Consumption | +5 VDC at 0.8 A (typical backplane current draw) |
| Processor | 1.2 GHz 32-bit ARM Cortex-A8 |
| System Memory | 512 MB DDR3 RAM |
| User Storage | 4 GB eMMC |
| I/O Capacity | Up to 32K digital inputs and 32K digital outputs (mixed configuration) |
| Boolean Execution Speed | 0.1 microseconds per instruction (typical) |
| Communication Interfaces | 2 x 10/100 Mbps Ethernet (RJ-45), 1 x RS-232/RS-485 composite port (DB9) |
| Supported Protocols | Ethernet/IP, Modbus TCP/IP, OPC UA, SNP-X, EGD |
| Redundancy | Supports RX3i dual-rack hot standby (firmware V3.0+) |
| Storage Temperature | -40 to +85 deg C |
| Relative Humidity | 5% to 95% non-condensing |
| Installation | Rack-mounted in RX3i chassis slot |
Industrial Control and Deterministic Network Operations
The control hardware employs specialized backplane bus communication velocity parameters to synchronize multi-rack system Topologies. Deterministic data transmission over industrial networks utilizes embedded Profinet or EtherNet/IP protocols to execute time-critical synchronization routines. Firmware flash compatibility rules require consistent microcode versions across both active and redundant backup processing nodes. The hardware layer enforces physical network isolation through dedicated MAC addressing structures, managing high I/O density scaling profiles without degradation of standard cyclic task schedules or execution jitter loops.
Frequently Asked Questions
Q: What firmware baseline is required to implement dual-rack hot standby functionality?
A: Dual-rack hot standby operations necessitate firmware version 3.0 or higher deployed on both active and redundant CPU units within the RX3i chassis network topology.
Q: What is the exact current allocation required from the backplane power supply?
A: The unit demands a typical current draw of 0.8 A from the +5 VDC backplane bus rail during nominal operation. System power budgets must account for this load alongside adjacent I/O infrastructure.
Field Installation Guidelines
Ensure total system power is isolated before inserting or removing the hardware from the PACSystems RX3i backplane chassis. Align the module with the designated single-slot chassis guides and press firmly until the top and bottom connectors fully engage the backplane receptacle. Secure the module using the integral chassis retention mechanisms to minimize mechanical vibration anomalies. Grounding integrity requires clean metal-to-metal contact between the module frame and the grounded chassis enclosure. All field communications wiring, including the RS-232/RS-485 DB9 link and dual RJ-45 Ethernet cables, must use industrial-grade shielded twisted pair (STP) cabling. Route low-voltage communication paths physically separated from high-voltage AC/DC power conductors to mitigate electro-magnetic interference limits.