IC695ETM001-EP GE Fanuc Ethernet Module | New & Original Stock
Manufacturer: GE Fanuc
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Part Number: IC695ETM001-EP
Condition：New with Original Package
Product Type: Digital I/O Cards
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC695ETM001 RX3i Ethernet Interface Module
The GE Fanuc IC695ETM001-EP, also cataloged as the IC695ETM001 Ethernet Interface Module, operates as a dedicated hardware component for network communication and data routing within PACSystems RX3i platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695ETM001-EP |
| Brand | GE Fanuc / Emerson |
| Origin | United States |
| Weight | 0.45 kg (1.00 lbs) |
| Dimensions | 3.8 cm x 13.5 cm x 14.0 cm (1.5 in x 5.3 in x 5.5 in) |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 0.9 A @ 3.3 VDC |
| Ethernet Interface | 2 independent autosensing 10/100 Mbps ports (8-pin female shielded RJ45) |
| Serial Interface | 1 RS-232 port (9-pin female D-connector) |
| Serial Data Rates | 1200 bps to 115200 bps |
| Duplex Modes | Half and full duplex |
| Network Protocols | TCP/IP, SRTP, Modbus TCP/IP |
| Connection Scaling | Up to 32 SRTP server and 16 Modbus TCP/IP server connections |
| Internal Processor | 200 MHz Ethernet processor |
| Memory Type | Non-volatile memory (supports daisy-chaining nodes) |
| Protection Class | IP20 |
| Storage Temp | -40 to 85 deg C |
Network Communication & Firmware Flash Compatibility
The IC695ETM001-EP relies on a dedicated 200 MHz internal communications processor to manage high-throughput network tasks independently of the primary controller CPU. To sustain stable backplane bus communication velocity and prevent packet degradation during concurrent traffic routing, system configurations require exact firmware flash compatibility between this interface and the host RX3i central processing unit.
When executing data mapping over Profinet or EtherNet/IP deterministic networks, maintaining identical major and minor firmware revisions prevents latency anomalies across the backplane bus. Proper firmware synchronization ensures the integrated non-volatile memory can sustain maximum connection limits—up to 32 SRTP and 16 Modbus TCP/IP sessions—without incurring processor cycle-time overruns.
Frequently Asked Questions
Q: Does the IC695ETM001-EP support Hot Module Insertion and Removal (RIUP)?
A: Yes. The hardware design of this Ethernet module allows it to be inserted into or removed from the universal RX3i backplane while power is applied to the rack, without disrupting the execution of adjacent modules or causing internal electronic component degradation.
Q: What is the purpose of the built-in serial RS-232 port on an Ethernet interface card?
A: The 9-pin female D-connector serves as a dedicated local interface for diagnostic tracking and initial module configuration via Proficy Machine Edition (PME). This port operates independently of the Ethernet networks, providing an isolated physical path for engineers during commissioning and troubleshooting.
Q: How do the autosensing network ports respond to differing hardware topologies?
A: The dual 10/100 Mbps ports automatically negotiate both link speed and duplex mode (half or full) depending on the connected network node. The layout supports both linear daisy-chain structures and segmented star topologies without the addition of intermediate standalone switches.
Field Installation Guidelines
- Backplane Insertion: Align the module frame with the selected universal RX3i slot guides. Press the module back smoothly until it meets the rear connectors, then engage the mechanical locking hooks to secure the device to the rack chassis ground.
- Shielding Ground Base: Connect all network lines using shielded twisted-pair (STP) cables. Terminate the metal cable shielding securely to the 8-pin female shielded RJ45 port casing to pass transient electromagnetic noise to ground.
- Conduit Separation: Route communication network drops through separate wiring ducts isolated from three-phase AC distribution lines, high-amperage switching circuits, and variable frequency drive outputs to avoid induction interference.
- Ambient Air Clearance: Leave a minimum clearance of 50 mm above and below the module rack assembly to provide unobstructed thermal convection through the IP20 ventilated housing.