IC695HSC308 GE Fanuc PACSystems RX3i Datasheet & Manual
IC695HSC308 GE Fanuc PACSystems RX3i Datasheet & Manual
IC695HSC308 GE Fanuc PACSystems RX3i Datasheet & Manual
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IC695HSC308 GE Fanuc PACSystems RX3i Datasheet & Manual

  • Manufacturer: GE Fanuc

  • Part Number: IC695HSC308-DA

  • Condition:New with Original Package

  • Product Type: High-Speed Counter Cards

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

GE Fanuc IC695HSC308 PACSystems RX3i High-Speed Counter Module

The GE Fanuc IC695HSC308-DA, also cataloged as the IC695HSC308 High-Speed Counter Module, operates as a dedicated hardware component for real-time high-frequency signal processing within PACSystems RX3i platforms.

Hardware Specifications

Parameter Specification
Model IC695HSC308-DA / IC695HSC308
Brand GE Fanuc (Emerson Automation)
Origin USA
Weight 0.40 kg (0.88 lbs)
Dimensions 35.0 mm x 130.0 mm x 135.0 mm (1.38 in x 5.12 in x 5.31 in)
Operating Temp 0 to 60 deg C
Power Consumption 2.32 W (561 mA @ 3.3 VDC, 94 mA @ 5 VDC maximum backplane draw)
Module Type High-Speed Counter Module
Number of Counter Channels 8 independent counters
Physical Terminal Inputs 16 discrete inputs
Physical Terminal Outputs 14 discrete outputs (4.7 to 40 VDC output voltage range)
Maximum Count Rates 1.5 MHz
Counting Range -2,147,483,648 to +2,147,483,547 (32-bit signed counter registers)
Counter Type Selection Type A, Type B, Type C, Type D, Type E, Type Z, and User Defined
Internal Timebase Accuracy +/-100 PPM over full operating temperature range
Oscillator Drift +/-5 PPM/year maximum over time
Isolation 250 VDC between field circuitry and internal logic side
Inter-Module Interface Hot insertion and extraction supported; I/O Interrupts supported

Firmware Flash Compatibility and I/O Density Scaling

The GE Fanuc IC695HSC308-DA relies on a local onboard processor to evaluate 1.5 MHz pulse streams completely outside the central host processing sequence. Field-side interfaces route through optocoupled circuits providing 250 VDC galvanic isolation to preserve data integrity across the high-speed RX3i PCI backplane. During comprehensive system I/O density scaling configuration, engineers must cross-check the module firmware flash compatibility against the main processor software version to ensure correct propagation of hardware-driven I/O interrupts. The 14 internal programmable outputs alter states within microseconds based on real-time 32-bit comparison presets, delivering sub-millisecond response latency without imposing processing overhead on the parent CPU bus.

Frequently Asked Questions

Q: How does the internal clock drift impact accuracy during long-term velocity measurement cycles? A: The module incorporates a stable crystal oscillator providing a baseline timing accuracy of +/-100 PPM across the 0 to 60 deg C operating range. Long-term aging drift is constrained to a maximum of +/-5 PPM per year, maintaining highly predictable frequency measurement intervals for turbine flowmeters and meter proving setups without manual calibration.

Q: Does the module support hot insertion and removal during live system operations? A: Yes. The hardware design fully supports hot insertion and extraction (RIUP) inside standard RX3i Universal Backplanes. The backplane bus logic isolates transients during transition, allowing field technicians to replace components without interrupting the processing behavior of adjacent active I/O cards.

Field Installation Guidelines

  • Baseplate Engagement Strategy: Align the module frame with the unpopulated PCI-slot track of the RX3i Universal Backplane. Pivot the card down until the high-density gold fingers lock cleanly into the backplane connectors, then fasten the locking screws to counter mechanical vibrations.
  • Signal Cable Shielding Protocol: Route high-frequency 1.5 MHz input signal conductors inside dedicated, continuous braided shielded twisted-pair cables. Ensure the shield mesh connects directly to the central chassis enclosure earth ground point to minimize external ambient electromagnetic noise.
  • Discrete Output Voltage Alignment: Verify that the external DC power supply feeding the 14 discrete transistor outputs stays strictly between 4.7 and 40 VDC. Reverse polarity protection is active, but overvoltage spikes past the limit run the risk of thermal damage to the switching matrix.
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