IC695PSA140 GE Fanuc Power Supply Module | New & Original Stock
IC695PSA140 GE Fanuc Power Supply Module | New & Original Stock
IC695PSA140 GE Fanuc Power Supply Module | New & Original Stock
/ 3

IC695PSA140 GE Fanuc Power Supply Module | New & Original Stock

  • Manufacturer: GE Fanuc

  • Part Number: IC695PSA140-CA

  • Condition:New with Original Package

  • Product Type: Power Supply Modules

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

GE Fanuc IC695PSA140 RX3i Power Supply Module

Configured for direct physical/electrical execution in PACSystems RX3i platforms, the GE Fanuc IC695PSA140 (IC695PSA140 Multi-Purpose Power Supply) operates as a dedicated hardware component for converting incoming AC or DC power into regulated DC voltages within Universal Backplane configurations. The module provides a regulated 5.1 VDC output directly to the backplane to power installed I/O modules and controllers without requiring external wiring adapters. It interfaces exclusively with the RX3i Universal Backplane structure, drawing from a dual-range input grid to sustain localized power distribution.

Hardware Specifications

Parameter Specification
Model IC695PSA140 / IC695PSA140CA
Brand GE Fanuc
Origin United States
Weight 1.19 lbs (0.54 kg)
Dimensions Standard RX3i chassis slot size
Operating Temp 0 to 60 deg C
Power Consumption 70 W maximum input power
Nominal Rated Voltage 120/240 VAC or 125 VDC
Input Voltage Range 85 to 264 VAC or 100 to 300 VDC
Input Current 1.0 A @ 120 VAC, 0.6 A @ 240 VAC
Line Frequency 50/60 Hz
Output Voltage 5.1 VDC regulated
Load Capacity 40 W maximum total output
Output Current Capacity 8 A @ 5.1 VDC
Inrush Current Less than 30 A peak
Efficiency Approximately 70 percent
Relative Humidity 5% to 95% non-condensing

Backplane Bus Communication Velocity and Deterministic Control

The IC695PSA140 interfaces directly with the high-speed PCI backplane bus architecture of the PACSystems RX3i chassis. While executing electrical power conversion, the module maintains strict impedance matching across the backplane connectors to preserve signal integrity for deterministic network protocols like Profinet or EtherNet/IP running on adjacent controllers. It manages internal current allocation to optimize I/O density scaling without inducing voltage drops on the local bus, ensuring that the synchronization clock and firmware flash processes remain uncorrupted during peak load shifts.

Frequently Asked Questions

Q: Can the IC695PSA140 power supply module be hot-swapped while the RX3i system is energized?

A: No. The IC695PSA140 does not support hot-swap capabilities. Inserting or removing this power supply module while the backplane or input line is energized can cause electrical arcing, damage internal circuit components, or cause unpredictable behavior in the active RX3i controllers.

Q: Does this module support parallel load sharing for N+1 power redundancy?

A: No. The IC695PSA140 is designed for standalone operation within an RX3i Universal Backplane slot. It lacks the internal isolation diodes and load-balancing circuitry necessary to link outputs in a parallel redundant configuration. Total system load allocation must remain under 40 W for a single slot.

Field Installation Guidelines

  • Chassis Insertion: The module must be installed in the dedicated power supply slot of a PACSystems RX3i Universal Backplane (IC695CHSxxx). Ensure the alignment hooks engage the chassis slots cleanly before locking the top and bottom retaining screws to establish firm backplane connections.
  • Input Wiring and Separation: Run the primary power source line (AC or DC) through dedicated conduits segregated from low-voltage signal wiring, such as 4-20 mA or communications lines, to minimize inductive coupling. Use standard industrial wire gauge compliant with the maximum 1.0 A load rating.
  • Shield Grounding: The ground terminal on the module's faceplate must be connected to the local site common ground bus using a low-impedance conductor. Ensure copper-to-copper grounding continuity to mitigate high-frequency noise spikes.
  • Thermal Clearance: Maintain standard vertical and horizontal clearance metrics around the RX3i enclosure as specified by general PLC infrastructure guidelines. Do not block the cooling vents located on the top and bottom face of the power supply housing.
You may also like