IC695PSD040 GE PACSystems RX3i Power Supply Module 24 VDC
Manufacturer: GE Fanuc
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Part Number: IC695PSD040C
Condition:New with Original Package
Product Type: Power Supply Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC695PSD040 RX3i Power Supply Module
Configured for power conversion and internal voltage distribution in PACSystem RX3i universal backplanes, the GE Fanuc IC695PSD040C (IC695PSD040 Power Supply Module) provides direct physical/electrical execution. It accepts a nominal 24 VDC input (18 to 30 VDC start range, 12 to 30 VDC continuous run range) and converts up to 60 W of maximum input power into regulated internal power rails. The unit delivers up to 40 W total output capacity across 5.1 VDC (0 to 6 A) and 3.3 VDC (0 to 9 A) internal bus buses to energize attached rack modules, alongside an auxiliary 24 VDC power tap for field relay circuits.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695PSD040 (Revision IC695PSD040C) |
| Brand | GE Fanuc / Emerson |
| Origin | USA / Mexico |
| Weight | 0.60 kg (1.31 lbs) |
| Dimensions | Standard PACSystems RX3i single-slot backplane module |
| Operating Temp | 0 deg C to +60 deg C |
| Power Consumption | 60 W maximum input power |
| Nominal Rated Voltage | 24 VDC |
| Input Voltage Range | Start: 18 to 30 VDC; Run: 12 to 30 VDC |
| Total Output Power | 40 W maximum |
| Output Bus Voltages | 5.1 VDC (0 to 6 A); 3.3 VDC (0 to 9 A) |
| Maximum Inrush Current | 4 A peak, 100 ms maximum duration |
| Holdup / Ride-Through Time | 10 ms minimum |
| Output Isolation | None |
| Output Voltage Ripple | 50 mV peak-to-peak |
| Wiring Terminal Gauge | 14 AWG to 18 AWG |
| Backplane Location | Dedicated Slot 0 of RX3i Universal Backplane |
System Backplane Architecture and Deterministic Bus Performance
The IC695PSD040 interfaces directly with the PACSystem RX3i PCI-based backplane bus communication velocity architecture, maintaining precise logic-side regulation without introducing voltage droop across high-density I/O configurations. Designed strictly for dedicated single-slot allocation in Slot 0, the internal DC-DC converter stages optimize I/O density scaling by directly feeding adjacent processing and communication hardware. Firmware flash compatibility across RX3i CPU families relies on stable 5.1 VDC and 3.3 VDC bus regulation during full-load power cycles, avoiding dynamic backplane logic faults during transient bus events.
Frequently Asked Questions
Q: Can multiple IC695PSD040 modules be combined to provide parallel load sharing or system power redundancy?
A: No. The IC695PSD040 does not support increased capacity mode or power supply redundancy. Daisy-chaining up to two modules via input terminals routes power cables sequentially, but does not increase total backplane output current. If backplane current draw exceeds 40 W, expansion backplanes must be added to distribute load power requirements across separate power supplies.
Q: How does the power supply handle brief voltage drops or input power loss on the 24 VDC line?
A: The module includes a minimum holdup/ride-through time of 10 ms. During input dips below 12 VDC or complete micro-interruptions lasting under 10 ms, internal energy storage capacitors sustain full output voltage and load regulation across the 5.1 VDC and 3.3 VDC rails without triggering system reset flags.
Field Installation Guidelines
Mounting the IC695PSD040 requires direct insertion into Slot 0 (leftmost position) of an RX3i universal backplane. Ensure backplane main power is fully de-energized prior to seating or unseating the module to prevent electrical arcing across backplane connectors. Grounding connections must follow strict single-point layout policies: connect system ground directly to the backplane earth lug using heavy-gauge wire, and keep signal wiring separated from high-voltage DC field wiring. Install 14 AWG to 18 AWG copper conductors directly into screw terminals, torquing terminal blocks to manufacturer specs. Maintain a minimum of 2 inches (50 mm) vertical clearance above and below the rack chassis to facilitate passive thermal dissipation across heat sinks.