IC695PSD040H GE Fanuc PACSystems RX3i Power Supply | New Stock
Manufacturer: GE Fanuc
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Part Number: IC695PSD040H
Condition：New with Original Package
Product Type: Power Supply Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC695PSD040H PACSystems RX3i Power Supply Module
Configured for dedicated voltage regulation in PACSystems RX3i architectures, the GE Fanuc IC695PSD040H (IC695PSD040 Universal Backplane Power Supply) provides direct physical/electrical execution. The module converts external DC source potentials into multiple stabilized internal rails across the backplane structure to energize adjacent logic processors, communication interfaces, and I/O assemblies. Its hardware configuration establishes immediate localized diagnostic tracking and short-term voltage ride-through capabilities within a single-slot footprint.
Suffix Breakdown & Model Matrix
- IC695PSD040: Base model designator for the PACSystems RX3i 40 Watt, 24 VDC input universal backplane power supply module.
- Suffix H: Identifies the manufacturing revision layer. This specific hardware release contains internal printed circuit board trace component alterations to maintain operational stability during thermal cycles and updates internal semiconductor selections to adhere to current hazardous location standard parameters.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695PSD040H |
| Brand | GE Fanuc (Emerson Automation) |
| Origin | United States |
| Weight | 0.34 kg |
| Dimensions | Standard PACSystems RX3i single-slot housing profile |
| Operating Temp | 0 to 60 deg C (Requires output thermal derating above 32 deg C) |
| Power Consumption | 60 W maximum input power draw to yield 40 W total output capacity |
| Nominal Input Voltage | 24 VDC |
| Input Voltage Range | 18 to 30 VDC (Startup mode threshold); 12 to 30 VDC (Continuous runtime mode) |
| Backplane Bus Outputs | 5.1 VDC (up to 30 W, 0 to 6 A); 3.3 VDC (up to 30 W, 0 to 9 A) |
| Auxiliary Output Rail | 24 VDC isolated output path intended exclusively for relay module loops |
| Ripple and Noise Output | Less than or equal to 50 mV peak-to-peak |
| Ride-Through Interruption | 10 ms minimum duration window at nominal load conditions |
| Peak Inrush Current | 4 A maximum transient spike lasting up to 100 ms |
| Galvanic Isolation | Non-isolated topology between input terminals and logic backplane |
| Mechanical Wiring Node | 14 to 22 AWG screw terminal configuration (Single conductor restriction) |
| Diagnostic Local Indicators | 4 x Faceplate LEDs (Power, P/S Fault, Overload, Overtemperature) |
| Hardware Interlock | Integrated manual On/Off toggle switch positioned behind protective access door |
| Backplane Slot Position | Restrictive installation to Slot 0 of the RX3i universal backplane frame |
Firmware Flash Compatibility and I/O Density Scaling
The GE Fanuc IC695PSD040H supplies continuous power across the universal backplane using structural interfaces that match parameters governed by backplane bus communication velocity licenses. This continuous delivery pattern prevents voltage sags from generating data frame errors during deep processor scans.
The board enables broad I/O density scaling profiles by concurrently maintaining the 5.1 VDC and 3.3 VDC supply bars at peak rated currents. This enables engineers to load adjacent chassis slots with high-density analog and digital modules without needing auxiliary intermediate power sub-racks. Because the hardware connects directly to the passive backplane bus, it tracks physical chassis changes while maintaining firmware flash compatibility constraints across all populated module types.
Frequently Asked Questions
Q: How does the thermal derating envelope affect the maximum output wattage capacity of the IC695PSD040H?
A: The hardware delivers its full 40 W output rating when ambient internal enclosure temperatures remain below 32 deg C. As the operating temperature rises above 32 deg C toward the 60 deg C upper limit, the internal linear components shift into a derated capacity curve, which reduces the total available output wattage to safeguard the internal tracking components from thermal breakdown.
Q: Can two IC695PSD040H modules be installed in a single RX3i chassis to construct a redundant load-sharing power system?
A: No. The electrical and physical architecture of the IC695PSD040H does not support parallel load sharing, auctioneering diodes, or active redundancy routines. The module must operate as a standalone power source dedicated to a single universal backplane frame, restricted to Slot 0.
Q: What action does the internal protection logic execute when an overtemperature or output overload state occurs?
A: The module relies on internal thermal and current monitoring circuits. If a continuous overload exceeds output capacity or internal temperatures cross safe boundaries, the respective diagnostic LED (Overload or Overtemperature) illuminates, and the P/S Fault indicator flags the host CPU to execute a controlled safe system shutdown.
Field Installation Guidelines
- Isolate all external 24 VDC power distribution feeders and tag out primary line breakers before starting terminal wiring changes.
- Align the module chassis tabs with the dedicated Slot 0 guide rails of the RX3i universal backplane, pressing the module backward until the connectors are fully engaged.
- Tighten the integrated faceplate retention screw to establish a solid frame-to-chassis mechanical and electrical ground bond.
- Strip a single 14 to 22 AWG copper conductor per terminal, seating the wire into the terminal block, and torque the terminal screw to standard specification to avoid thread distortion.
- Run all external 24 VDC supply cabling through separate lower wire ways, ensuring a minimum distance of 30 cm from high-voltage AC cables or frequency converter lines.