IC695PSD140CA GE Fanuc PACSystems RX3i Datasheet & Manual
IC695PSD140CA GE Fanuc PACSystems RX3i Datasheet & Manual
IC695PSD140CA GE Fanuc PACSystems RX3i Datasheet & Manual
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IC695PSD140CA GE Fanuc PACSystems RX3i Datasheet & Manual

  • Manufacturer: GE Fanuc

  • Part Number: IC695PSD140CA

  • Condition:New with Original Package

  • Product Type: PLC Power Supply Modules

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

GE Fanuc IC695PSD140 Universal Power Supply Module

The GE Fanuc IC695PSD140CA, also cataloged as the IC695PSD140 Multi-Purpose Power Supply Module, operates as a dedicated hardware component for voltage regulation and electrical distribution within PACSystems RX3i Universal Backplanes.

Hardware Specifications

Parameter Specification
Model IC695PSD140CA / IC695PSD140
Brand GE Fanuc (Emerson Automation)
Origin USA
Weight 0.40 kg (0.88 lbs)
Dimensions Standard PACSystems RX3i single-slot module dimensions
Operating Temp 0 to 60 deg C
Nominal Input Voltage 24 VDC
Operating Input Range 18 to 30 VDC
Maximum Power Capacity 40 W total load
Internal Voltage Outputs +5.1 VDC, +3.3 VDC, +24 VDC Relay output
Redundancy Support N+1 parallel redundant mode, supports up to 4 identical modules
Load-Sharing Execution Active load-sharing circuitry integrated
Isolation Barrier None (input ground referenced directly to the backplane ground)
Front Panel Control Toggle switch (controls voltage outputs; does not isolate line input)
Physical Layer Protection Conformal coating for harsh environments (CA version)
Status Visual Signalling Front LEDs for Power, P/S Fault, Overload, Overtemperature
Terminal Wire Gauge 14 to 22 AWG copper conductors, 1 wire per terminal

Redundancy Support and Active Load-Sharing Execution

The GE Fanuc IC695PSD140CA incorporates internal tracking logic to execute parallel N+1 configuration matrices when seated side-by-side with up to three identical power modules on an RX3i Universal Backplane. This layout distributes active current draw uniformly across the active internal rails, ensuring balanced component thermal dissipation profiles and maintaining background backplane bus communication velocity during peak transaction intervals. The onboard active load-sharing circuits handle load adjustments dynamically during runtime without causing voltage sags on the 5.1 VDC or 3.3 VDC buses. Mixing this 40 W hardware with alternative lower-capacity power variants like the IC695PSD040 or IC695PSA040 is strictly barred, as mismatched source impedances disable load-sharing logic and run the risk of module overload.

Frequently Asked Questions

Q: Can this power supply module be hot-swapped while the PACSystems RX3i system is running? A: No. While certain RX3i I/O cards permit live insertion, the Universal Backplane power distribution lines do not feature electrical isolating interlocks for this module category. All primary 24 VDC input lines must be isolated prior to insertion or removal to prevent physical contact arcing or disruption of the active processing backplane bus lines.

Q: What is the mechanical function of the toggle switch located on the front faceplate? A: The front-mounted on/off toggle switch isolates the internal secondary output circuits (+5.1 VDC, +3.3 VDC, and +24 VDC Relay) from the backplane traces. It does not disconnect the incoming 18 to 30 VDC field supply from the input terminal strip, meaning live field terminal potentials persist even when the switch is set to the off position.

Field Installation Guidelines

  • Chassis Slot Allocation: Slide the single-slot power supply module into the designated slot on the RX3i Universal Backplane. Ensure the upper and lower plastic hooks lock firmly onto the chassis rail to offset resonant industrial vibrations.
  • Terminal Wiring Restrictions: Strip 24 VDC supply conductors to standard industrial metrics, securing a single copper wire between 14 and 22 AWG into each individual terminal point. Do not double-wire terminal blocks, as unbalanced torque values lead to loose terminations and local resistive heating.
  • Environmental Shield Grounding: Because the module lacks input-to-backplane electrical isolation, connect a heavy-duty, low-impedance copper ground braid from the central backplane grounding lug directly to the enclosure main earth grounding plate. This layout prevents electrical noise spikes from distorting local processor logic states.
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