IC695RMX128-FH GE Fanuc Memory Module | New & Original Stock
Manufacturer: GE Fanuc
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Part Number: IC695RMX128-FH
Condition：New with Original Package
Product Type: Redundant Memory Exchange Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC695RMX128-FH PACSystems RX3i Series
Configured for high-availability data replication in PACSystems RX3i networks, the GE Fanuc IC695RMX128-FH (GE Fanuc IC695RMX128 Redundant Memory Exchange Module) provides direct physical/electrical execution.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695RMX128-FH |
| Brand | GE Fanuc |
| Origin | USA / Global Manufacturing |
| Weight | 0.35 kg |
| Dimensions | 160 mm x 100 mm x 45 mm |
| Operating Temp | 0 to +60 deg C |
| Power Consumption | Backplane logic load dependent |
| Product Type | Redundant Memory Exchange Module |
| Shared Memory Capacity | 128 MB |
| Access Type | High-speed dual-port memory exchange |
| Data Synchronization | Deterministic, real-time replication |
| Sync Latency | < 1 ms typical |
| Platform Compatibility | PACSystems RX3i |
| Diagnostics | Via Proficy Machine Edition tools |
| Storage Temperature | -40 to +85 deg C |
| Relative Humidity | 5-95% RH, non-condensing |
| Certifications | UL, CE, CSA, RoHS compliant |
Industrial Control and Drives Deterministic Synchronization
The reflective memory architecture implements real-time mirror processing to map execution points between primary and backup controller nodes. This module scales memory parameters via standard backplane bus communication velocity Licences, maintaining data duplication boundaries under a 1 ms latency threshold. The high-speed shared memory engine operates alongside external Profinet / EtherNet/IP deterministic networks, enforcing synchronized register states across the 128 MB local partition. This interface works independently of firmware flash compatibility changes to guarantee that I/O density scaling transitions do not disrupt active machine tasks or drop critical communication tracks during a localized CPU switchover.
Frequently Asked Questions
Q: What are the backplane current constraints and logic bus load metrics for this memory module?
A: The IC695RMX128-FH derives all internal electronic processing power from the RX3i chassis rails. System engineers must include the module's continuous milliamp draw within the main backplane load calculations to prevent over-current faulting of the primary chassis rack power supply.
Q: Does the dual-port memory module support hot-swap extraction while a redundancy tracking cycle is active?
A: The PACSystems RX3i rack platform supports hot-swap physical insertion and removal. However, removing an active IC695RMX128-FH module breaks the synchronization layer between the primary and backup CPUs instantly, which disables the hot-standby redundancy mechanism until a replacement card is seated and verified.
Field Installation Guidelines
- Chassis Card Cage Seating: Position the module within the designated hardware slot of the PACSystems RX3i universal backplane. Drive the assembly down along the plastic tracks until the dual-port rear pins lock fully into the motherboard socket, then secure the top and bottom latch fasteners.
- Redundancy Link Cable Management: Connect the high-speed fiber-optic or dedicated interface interconnects directly to the corresponding memory exchange partner module. Avoid tight cable routing bends to maintain signal propagation velocity and suppress tracking errors.
- Cabinet Thermal Boundary Clearances: Verify that the vertical convective air corridors within the enclosure remain completely unobstructed. Maintain the ambient temperature surrounding the RX3i rack between 0 and +60 deg C to ensure continuous, non-degraded memory mirror performance.