IC697BEM713 GE Fanuc Series 90-70 Datasheet & Technical Manual
IC697BEM713 GE Fanuc Series 90-70 Datasheet & Technical Manual
IC697BEM713 GE Fanuc Series 90-70 Datasheet & Technical Manual
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IC697BEM713 GE Fanuc Series 90-70 Datasheet & Technical Manual

  • Manufacturer: GE Fanuc

  • Part Number: IC697BEN713G

  • Condition:New with Original Package

  • Product Type: PLC Communication Modules

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

GE Fanuc IC697BEM713 Bus Transmitter Module

The GE Fanuc IC697BEM713E, also cataloged as the IC697BEM713 Bus Transmitter Module, operates as a dedicated hardware component for multi-rack system expansion within GE Fanuc Series 90-70 PLC platforms.

Hardware Specifications

Parameter Specification
Model IC697BEM713E / IC697BEM713F / IC697BEM713G / IC697BEM713
Brand GE Fanuc (Emerson)
Origin USA
Weight 0.43 kg (0.94 lbs)
Dimensions Standard Series 90-70 single-slot module dimensions
Operating Temp 0 to 60 deg C
Power Consumption 7.0 W (1.4 A @ 5 VDC)
Module Type Bus Transmitter Module (BTM)
System Compatibility Series 90-70 PLC
Expansion Capacity Up to 7 additional IC697 expansion racks
Effective Data Rate 500 Kbytes/sec
Maximum Cable Distance 50 feet
Communication Interface Non-isolated differential communication
Connectors 1 x Top Programmer Port, 1 x Bottom Expansion Port
Status Indicators 3 x Diagnostic LEDs (MODULE OK, PGMR, EXPANSION PORT)
Configuration Software-defined (no hardware DIP switches)

Backplane Bus Communication Velocity and Firmware Flash Compatibility

The GE Fanuc IC697BEM713 utilizes a high-speed parallel bus interface operating across the standard Series 90-70 backplane. It coordinates data packet routing to external expansion racks via non-isolated differential communication lines at an effective data rate of 500 Kbytes/sec. System integration requires precise synchronization between the host CPU firmware flash compatibility parameters and the hardware revision of the Bus Receiver Modules (BRMs) connected in the downstream daisy-chain. Backplane bus communication velocity remains stable under maximum I/O density scaling up to the 7-rack system boundary limit.

Frequently Asked Questions

Q: Can this module be hot-swapped while the local backplane is energized?

A: No. The backplane power supply must be completely turned off before inserting or extracting the module. Live insertion or extraction will cause severe disruptions on the VME parallel bus, resulting in data corruption, unexpected CPU faults, or physical damage to the module circuitry.

Q: Does this module require physical jumper changes or DIP switch settings during commissioning?

A: No physical DIP switches or jumpers exist on the circuit board. All configuration and rack allocation maps are defined via MS-DOS or Windows-based programming software, which pushes configuration files directly to the module upon CPU synchronization.

Field Installation Guidelines

  • Slot Allocation Restrictions: Do not install this module in Slot 1 of the rack, which is reserved exclusively for the CPU. The module must be positioned in a standard I/O slot located to the right of any hardware interrupt source modules.
  • Grounding and Shielding Protocols: Connect expansion cables tightly to the designated top and bottom connectors. Ensure that the integrated cable shielding maintains structural integrity across the maximum allowable 50-foot run to suppress electrical noise and signal attenuation on the differential lines.
  • LED Status Verification Sequence: Upon system startup, confirm that the top MODULE OK LED remains illuminated. A blinking or dark LED indicates that the host CPU has failed to verify the module configuration or that one of the downstream expansion racks has timed out during the parallel bus poll sequence.
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