IC697CHS782 GE Fanuc Series 90-70 VME Integrator Rack
Manufacturer: GE Fanuc
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Part Number: IC697CHS782
Condition：New with Original Package
Product Type: PLC Racks
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC697CHS782 Series 90-70 Rear Mount VME Integrator Rack
The GE Fanuc IC697CHS782, also cataloged as the IC697CHS782 Rear Mount VME Integrator Rack, operates as a dedicated hardware component for mechanical housing, backplane bus signal distribution, and DC power routing within GE Fanuc Series 90-70 PLC platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC697CHS782 |
| Brand | GE Fanuc / Emerson |
| Origin | United States |
| Weight | 6.24 kg (13.75 lbs) |
| Dimensions | Fits inside a 10-inch deep panel enclosure |
| Operating Temp | -20 to 60 deg C |
| Power Consumption | Passive chassis (power distributed via installed PSU) |
| Slot Capacity | 17 slots + 1 dedicated power supply slot |
| Slot Spacing | 0.8 inches |
| Module Compatibility | IC697 2-slot modules and third-party 1-slot VME modules |
| Cooling Method | Natural convection (optional fan assembly supported) |
| Mounting Type | Rear panel mount |
| Relative Humidity | 5 to 95% non-condensing |
Industrial Controller Architecture & Bus Network Attributes
This VME integrator rack provides high-speed backplane bus communication velocity across its 17 card slots, maintaining signal integrity between installed CPUs, communication interfaces, and I/O modules. System engineering permits aggressive I/O density scaling by supporting both standard 2-slot IC697 modules and third-party 1-slot VME hardware. The backplane design ensures firmware flash compatibility and deterministic execution by maintaining stable 5 VDC power distribution rail pathways across all connected expansion cards.
Frequently Asked Questions
Q: Does the backplane architecture support hot-swap replacement of I/O modules while powered?
A: No, module insertion or removal requires de-energizing the main power supply feeding the rack backplane to prevent electrical arcing and logic corruption on the VME bus line.
Q: How is supplemental airflow provided if natural convection proves insufficient in high-density enclosures?
A: System integrators can install an optional top-mounted or bottom-mounted fan assembly directly to the chassis frame to force air movement across high-power density cards.
Q: Can this chassis support redundant CPU backplane configurations?
A: No, the IC697CHS782 chassis architecture does not support dual-redundant CPU backplane configurations.
Field Installation Guidelines
Mount the chassis onto a flat vertical panel inside an enclosure with a minimum depth of 10 inches using appropriate mechanical fasteners. Maintain at least 75 mm of clear vertical space above and below the rack to permit unimpeded natural convection cooling. Connect the dedicated protective earth grounding stud on the chassis directly to the main cabinet ground bus using a short, low-impedance copper strap. When installing power supplies and expansion modules, verify that card guide alignment pins seat completely into the rear backplane connectors before tightening front retaining screws.