IC698PSA100D GE Power Supply Module Datasheet & Technical Manual
Manufacturer: GE Fanuc
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Part Number: IC698PSA100D
Condition：New with Original Package
Product Type: Power Supply Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE IC698PSA100D PACSystems RX7i Power Supply Module
Configured for specific technical tasks in PACSystems RX7i universal backplane platforms, the GE IC698PSA100D (IC698PSA100 Power Supply Module) provides direct physical/electrical execution. The hardware executes regulated voltage conversion, transforming raw incoming single-phase alternating current into stabilized direct current pathways across the internal logic planes. It operates within a single chassis slot to provide the high-amperage logic-side rails required to maintain backplane bus communications during processing tasks.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC698PSA100D |
| Brand | GE (GE Fanuc / Emerson) |
| Origin | USA |
| Weight | 0.3 kg (0.66 lbs) |
| Dimensions | 3.5 cm x 13.0 cm x 13.5 cm |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 143 W maximum input power (at approximately 70 percent efficiency at full load) |
| Input Voltage Range | 90 to 264 VAC (47-63 Hz) |
| Input Current Load | 1.0 A @ 120 VAC, 0.6 A @ 240 VAC |
| Output Voltage | 5.1 VDC regulated |
| Output Current Capacity | 20 A @ 5.1 VDC |
| Total Load Capacity | Up to 100 W total output power |
| Inrush Current | Less than 30 A peak |
| Backplane Compatibility | RX7i universal backplane only |
| Relative Humidity | 5% to 95% non-condensing |
| Storage Temperature | -40 to 85 deg C |
Profinet / EtherNet/IP Deterministic Networks and I/O Density Scaling
The IC698PSA100D delivers a continuous 20 A output at 5.1 VDC to maintain the backplane bus communication velocity across complex RX7i chassis layouts. This baseline current stability is required when synchronizing high-density tracking arrays that communicate upstream over Profinet or EtherNet/IP deterministic networks. Proper calculation of the I/O density scaling footprint prevents drops in logic rail voltage, ensuring that processing nodes can execute high-speed operations and firmware flash sequences without data packets dropping during cyclic backplane sweeps.
Frequently Asked Questions
Q: Can this power supply module be hot-swapped while the PACSystems RX7i chassis is active?
A: No. The RX7i architecture requires complete isolation of incoming line voltage before extracting or inserting the power supply. Hot-swapping the module can cause severe backplane voltage transients, trigger system processor faults, or damage the physical connector contacts via micro-arcing.
Q: What internal mitigation measures handle field-side electrical faults or over-temperature events?
A: The module contains dedicated overcurrent and thermal sensing circuits. If the total current drawn across the 5.1 VDC backplane rail exceeds the 100 W threshold, or if internal heatsink profiles rise beyond safe operational limits, the power supply enters a safe shutdown execution mode, dropping output voltage until the fault condition is cleared.
Field Installation Guidelines
- Chassis Alignment: Disconnect the primary line power grid before attempting installation. Slide the module completely into its designated single-slot orientation on the RX7i universal backplane. Ensure the rear multi-pin seating connectors register smoothly before securing the integrated physical mounting screws.
- Line Wire Pathing: Route incoming AC power lines away from parallel low-voltage analog signal lines or digital communication lines inside the cabinet. Use dedicated wire management trunks to minimize inductive cross-talk and high-frequency noise injection.
- Ground Termination: Terminate the grounding lead from the module interface to the local copper grounding bar using the shortest possible length of thick-gauge conductor. Proper grounding pathing is necessary to clear surge voltage transients before they reach the logical backplane.
- Total Load Verification: Sum the individual 5.1 VDC current demands of all populated processing, communication, and I/O modules on the rack. The cumulative current load must remain below the 20 A threshold to prevent power supply saturation.