IS200TRLYH1BGF GE Mark VI/VIe Relay Output Terminal Board
Manufacturer: GE Fanuc
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Part Number: IS200TRLYH1BGF
Condition：New with Original Package
Product Type: Relay Output Terminal Boards
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE IS200TRLYH1BGF Mark VI/Mark VIe Relay Output Terminal Board
Configured for discrete signal switching in Mark VI and Mark VIe Speedtronic architectures, the GE IS200TRLYH1BGF (IS200TRLYH1BGF Relay Output Terminal Board) provides direct physical and electrical execution of high-current load control.
Suffix Breakdown & Model Matrix
The IS200TRLYH1BGF nomenclature identifies the specific hardware iteration of the Mark VI terminal board series. The "IS200" prefix designates the GE Industrial Systems product line, while the "TRLY" identifier denotes the Relay Output Terminal Board function. The "H1B" string specifies the primary hardware configuration, and the "GF" suffix represents the latest manufacturing revision, incorporating optimized trace routing and improved PCB fabrication standards to maintain operational consistency across existing control rack deployments.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IS200TRLYH1BGF |
| Brand | GE Mark VI / Mark VIe |
| Origin | USA |
| Weight | 0.2 kg |
| Dimensions | 12.2 cm x 12.4 cm x 12.6 cm |
| Operating Temp | -20 deg C to 65 deg C |
| Power Consumption | Backplane dependent |
| Performance | 12 Form-C relay outputs, 5 A contact rating |
Profinet / EtherNet/IP Deterministic Networks
The IS200TRLYH1BGF utilizes a deterministic interface to receive control signals from the associated I/O pack, ensuring that relay actuation occurs within the scan cycle of the Mark VI/Mark VIe processor. Firmware flash compatibility within the system allows for the integration of diagnostic monitoring logic that tracks relay coil health and contact states. The module supports I/O density scaling by allowing multiple boards to be daisychained or configured in redundant pairs for TMR (Triple Modular Redundant) applications. By maintaining strict timing between the D-Sub processor interface and the physical relay output, the board ensures synchronized execution of critical turbine control commands.
Frequently Asked Questions
Q: Does the IS200TRLYH1BGF support hot-swapping under load?
A: No, field installation guidelines mandate that the control power must be isolated from the relay contacts and the I/O pack before removing or inserting the board to prevent accidental arcing on the connector pins.
Q: How do the built-in suppression circuits affect inductive load switching?
A: The board includes passive suppression components that mitigate back-EMF spikes during the de-energization of inductive loads, protecting the relay contacts from pitting and extending the functional lifespan of the output channels.
Field Installation Guidelines
Mount the IS200TRLYH1BGF securely onto the DIN rail or panel surface within the control cabinet. Connect the 37-pin D-Sub interface cable to the corresponding I/O pack, ensuring the locking screws are tightened to maintain a secure communication link. Terminate external field wiring to the screw terminals, ensuring proper wire gauge for the 5 A load capacity and grounding all cable shields to the cabinet common to minimize EMI. Prior to system operation, perform a manual relay test via the Control System Toolbox to verify continuity and contact closure for each of the 12 output channels.