Mixed Discrete I/O Module 24 VDC | GE IC200MDD750 VersaMax
Mixed Discrete I/O Module 24 VDC | GE IC200MDD750 VersaMax
Mixed Discrete I/O Module 24 VDC | GE IC200MDD750 VersaMax
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Mixed Discrete I/O Module 24 VDC | GE IC200MDD750 VersaMax

  • Manufacturer: GE Fanuc

  • Part Number: IC200MDD750

  • Condition:New with Original Package

  • Product Type: Digital I/O Cards

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

GE Fanuc IC200MDD750 VersaMax Mixed Discrete I/O Module

The GE Fanuc IC200MDD750, also cataloged as the IC200MDD750 Mixed Discrete I/O Module, operates as a dedicated hardware component for high-density discrete signal acquisition and relay/sourcing control output within VersaMax network platforms. This unit combines 16 discrete DC inputs and 16 discrete DC outputs within a single compact module footprint. Internal optical isolation separates the field-side electrical circuits from the host controller logic backplane.

Hardware Specifications

Parameter Specification
Model IC200MDD750
Brand GE Fanuc
Origin USA
Weight 0.35 kg
Dimensions 120 mm x 90 mm x 40 mm
Operating Temp 0 deg C to 60 deg C
Power Consumption 24 VDC field supply / logic side bus load dependent
Input Points 16 discrete DC inputs (24 VDC nominal, 18-30 VDC range)
Output Points 16 discrete DC outputs (positive logic sourcing, 24 VDC nominal)
Output Current Capacity 0.5 A per point, 2 A per common
Signal Response Time 0.5 ms maximum ON/OFF
Field-to-Logic Isolation 1500 VAC peak continuous

Backplane Bus Communication and Firmware Compatibility

The module communicates via the VersaMax backplane, utilizing high-speed bus arbitration to maintain deterministic signal updates. Host CPU firmware flash compatibility permits transparent integration across standard VersaMax racks and expansion bases. High-density I/O density scaling provided by this 32-point total module footprint optimizes rack space utilization, ensuring that backplane bus communication velocity remains stable under maximum slot configurations.

Frequently Asked Questions

Q: What is the isolation rating between the field-side wiring and internal backplane logic?

A: Optical isolation circuits provide 1500 VAC galvanic isolation between the field input/output wiring terminals and the internal backplane logic.

Q: Can the output channels handle more than 0.5 A per point?

A: Individual channels support up to 0.5 A at 24 VDC continuous, but aggregate load must not exceed 2 A per common bus return to prevent thermal trace degradation.

Q: How does the module indicate signal status for troubleshooting?

A: Dedicated LED indicators mounted on the front face display real-time ON/OFF state status for each individual input and output point.

Field Installation Guidelines

Mount the module directly onto a 35 mm DIN rail or secure it via panel-mount fasteners. Ensure field wiring connects to the removable terminal block assembly after stripping conductor insulation to standard lengths. Separate 24 VDC field wiring from AC power lines inside wire ducts to suppress inductive noise coupling. Connect field cable shields to a single-point panel ground lug. Maintain at least 50 mm of vertical clearance around the module enclosure to support natural convection cooling within cabinet environments.

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