MX213/W Bachmann CPU Processor Module | New & Original Stock
Manufacturer: Bachmann
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Part Number: MX213/W
Condition：New with Original Package
Product Type: CPU Processors
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Country of Origin: Austria
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
Bachmann MX213/W MX200 Series CPU Module
The Bachmann MX213/W, also cataloged as the MX213/W CPU Module, operates as a dedicated hardware component for processing, communication, and system management within Bachmann M1 controller system networks.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | MX213/W |
| Brand | Bachmann |
| Origin | Austria |
| Weight | 0.6 to 0.67 kg |
| Dimensions | 5.5 cm x 5.5 cm x 12.0 cm |
| Operating Temp | -30 to +60 deg C |
| Power Consumption | Integrated supply for local I/O module rails |
| Processor Architecture | x86 AMD LX industrial low-voltage CPU |
| Clock Frequency | 266 MHz |
| Volatile Memory | 256 MB DRAM |
| Non-Volatile Memory | 512 kB nvRAM (Retention period greater than 10 years) |
| Onboard Storage | 64 MB CompactFlash |
| Communication Interfaces | 2 x Ethernet 10/100 Mbit/s, 2 x Serial (RS-232, RS-422/485), 1 x USB 2.0, 1 x CAN/CANopen |
| Status Visuals | Front-panel LEDs for RUN, INIT, and ERROR |
| Cooling Methodology | Fanless natural convection |
Backplane Bus Communication and Firmware Architecture
The MX213/W processes synchronous execution cycles across the internal backplane bus communication velocity link, maintaining deterministic I/O density scaling during high-frequency tasks. The integrated x86 processor executes real-time multitasking routines with priority-based scheduling, matching the local cyclic requirements of the M1 rack configuration. Firmware flash compatibility protocols guarantee structured memory allocation across the 64 MB onboard storage and external CompactFlash expansion slots. The hardware architecture incorporates a dedicated 512 kB nvRAM sector, protecting volatile process matrices by securing variable states and system registers against complete power failures without relying on external battery cells.
Frequently Asked Questions
Q: What are the technical limitations regarding firmware flash updates and storage expansion on the MX213/W?
A: Firmware synchronization must align precisely with the real-time operating system parameters stored in the default memory space. Storage expansions via the integrated CompactFlash slot are restricted to validated industrial cards up to 4 GB to maintain standard file allocation table indexing speeds.
Q: How does the fanless thermal design affect the power distribution capacity to adjacent I/O modules?
A: The passive thermal convection profile relies on vertical air currents over the integrated protective coating. When operating at the upper thermal boundary of +60 deg C, the total current draw allocated to the local backplane bus must be restricted to prevent local thermal throttling of the processor core.
Field Installation Guidelines
- Mounting Matrix and Thermal Clearances: Ensure the module is securely fastened to the specified mounting rail assembly within a dust-protected metal enclosure. Maintain a minimum vertical clearance of 50 mm above and below the module housing to allow unrestricted convective airflow.
- Backplane Engagement Verification: Prior to applying system power, verify that the module backplane connectors are fully aligned and seated onto the M1 rack terminal assembly. Do not insert or extract the module while the primary supply line is live.
- Shield Terminal Bonding Protocol: Connect the integrated drain wires from the dual Ethernet cables and serial interfaces to the primary functional earth bar using low-impedance grounding straps to minimize high-frequency electromagnetic field disruptions.
- Interface Torque Specifications: Secure all serial and CAN communication terminal screws to the factory recommended torque values to prevent localized physical separation caused by continuous mechanical plant vibrations ranging up to 500 Hz.