{"product_id":"mx213-w-bachmann-cpu-processor-module-new-original-stock","title":"MX213\/W Bachmann CPU Processor Module | New \u0026 Original Stock","description":"\u003ch2\u003eBachmann MX213\/W MX200 Series CPU Module\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eBachmann MX213\/W\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eMX213\/W\u003c\/strong\u003e CPU Module, operates as a dedicated hardware component for processing, communication, and system management within \u003cstrong\u003eBachmann M1\u003c\/strong\u003e controller system networks.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eMX213\/W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eBachmann\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eAustria\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.6 to 0.67 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e5.5 cm x 5.5 cm x 12.0 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e-30 to +60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003eIntegrated supply for local I\/O module rails\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProcessor Architecture\u003c\/td\u003e\n\u003ctd\u003ex86 AMD LX industrial low-voltage CPU\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eClock Frequency\u003c\/td\u003e\n\u003ctd\u003e266 MHz\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVolatile Memory\u003c\/td\u003e\n\u003ctd\u003e256 MB DRAM\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eNon-Volatile Memory\u003c\/td\u003e\n\u003ctd\u003e512 kB nvRAM (Retention period greater than 10 years)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOnboard Storage\u003c\/td\u003e\n\u003ctd\u003e64 MB CompactFlash\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCommunication Interfaces\u003c\/td\u003e\n\u003ctd\u003e2 x Ethernet 10\/100 Mbit\/s, 2 x Serial (RS-232, RS-422\/485), 1 x USB 2.0, 1 x CAN\/CANopen\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStatus Visuals\u003c\/td\u003e\n\u003ctd\u003eFront-panel LEDs for RUN, INIT, and ERROR\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling Methodology\u003c\/td\u003e\n\u003ctd\u003eFanless natural convection\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication and Firmware Architecture\u003c\/h3\u003e\n\u003cp\u003eThe MX213\/W processes synchronous execution cycles across the internal backplane bus communication velocity link, maintaining deterministic I\/O density scaling during high-frequency tasks. The integrated x86 processor executes real-time multitasking routines with priority-based scheduling, matching the local cyclic requirements of the M1 rack configuration. Firmware flash compatibility protocols guarantee structured memory allocation across the 64 MB onboard storage and external CompactFlash expansion slots. The hardware architecture incorporates a dedicated 512 kB nvRAM sector, protecting volatile process matrices by securing variable states and system registers against complete power failures without relying on external battery cells.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: What are the technical limitations regarding firmware flash updates and storage expansion on the MX213\/W?\u003c\/p\u003e\n\u003cp\u003eA: Firmware synchronization must align precisely with the real-time operating system parameters stored in the default memory space. Storage expansions via the integrated CompactFlash slot are restricted to validated industrial cards up to 4 GB to maintain standard file allocation table indexing speeds.\u003c\/p\u003e\n\u003cp\u003eQ: How does the fanless thermal design affect the power distribution capacity to adjacent I\/O modules?\u003c\/p\u003e\n\u003cp\u003eA: The passive thermal convection profile relies on vertical air currents over the integrated protective coating. When operating at the upper thermal boundary of +60 deg C, the total current draw allocated to the local backplane bus must be restricted to prevent local thermal throttling of the processor core.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eMounting Matrix and Thermal Clearances:\u003c\/strong\u003e Ensure the module is securely fastened to the specified mounting rail assembly within a dust-protected metal enclosure. Maintain a minimum vertical clearance of 50 mm above and below the module housing to allow unrestricted convective airflow.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBackplane Engagement Verification:\u003c\/strong\u003e Prior to applying system power, verify that the module backplane connectors are fully aligned and seated onto the M1 rack terminal assembly. Do not insert or extract the module while the primary supply line is live.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eShield Terminal Bonding Protocol:\u003c\/strong\u003e Connect the integrated drain wires from the dual Ethernet cables and serial interfaces to the primary functional earth bar using low-impedance grounding straps to minimize high-frequency electromagnetic field disruptions.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eInterface Torque Specifications:\u003c\/strong\u003e Secure all serial and CAN communication terminal screws to the factory recommended torque values to prevent localized physical separation caused by continuous mechanical plant vibrations ranging up to 500 Hz.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Bachmann","offers":[{"title":"Default Title","offer_id":43881621651555,"sku":"MX213\/W","price":236.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0583\/5246\/8067\/files\/28_b52e3073-26d9-4aa7-9696-a61751245987.jpg?v=1765333375","url":"https:\/\/www.autocontrolglobal.com\/products\/mx213-w-bachmann-cpu-processor-module-new-original-stock","provider":"AutoControl Global","version":"1.0","type":"link"}