Redundancy CPU Module | GE Fanuc IC695CRU320-EN
Manufacturer: GE Fanuc
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Part Number: IC695CRU320-EW
Condition：New with Original Package
Product Type: Redundancy CPU Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC695CRU320-EN PACSystems RX3i Redundant Processor
The GE Fanuc IC695CRU320-EN, also cataloged as the GE Fanuc IC695CRU320 Redundant Processor, operates as a dedicated hardware component for hot-standby logic execution and backup synchronization within PACSystems RX3i platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695CRU320-EN |
| Brand | GE Fanuc / Emerson |
| Origin | USA |
| Weight | 0.75 kg |
| Dimensions | 166 mm x 47 mm x 140 mm |
| Operating Temp | 0 to +60 deg C (Storage: -40 to +85 deg C) |
| Power Consumption | Maximum 350 mA |
| Operating Voltage | 5 VDC from RX3i chassis backplane |
| Processor | Intel Celeron M, 1 GHz with floating-point support |
| Memory | 64 MB battery-backed RAM + 64 MB non-volatile Flash |
| Redundancy Switchover | As low as 3.133 ms (less than or equal to 1 logic scan) |
| Synchronization Logic | Complements IC695RMX128/228 modules with up to 2 MB data transfer |
| Serial Interfaces | 2 x RS-232/RS-485 ports (Modbus master/slave, SNP, serial I/O) |
| Network Capability | Ethernet via dedicated expansion modules |
| I/O Capacity | Up to 131,072 discrete points, 16,384 analog points |
| Control Functions | Logic control, PID process control, motion control (up to 64 axes), safety logic |
Industrial Control Backplane and Deterministic Network Coupling
The IC695CRU320-EN routes discrete and analog variables across the PACSystems RX3i backplane bus using high-velocity data transceivers. The module maintains native firmware flash compatibility to match internal execution baselines across primary and secondary dual controller racks. Operating over Profinet / EtherNet/IP deterministic networks via expansion modules, the CPU coordinates dynamic I/O density scaling profiles, executing hot-standby synchronization loops up to a 2 MB data payload capacity per cycle without introducing logic latency.
Frequently Asked Questions
Q: What is the power distribution demand of the module from the chassis backplane?
A: The hardware draws a maximum current of 350 mA exclusively from the 5 VDC rail of the RX3i chassis backplane.
Q: What is the specific data switchover latency during a primary CPU fault?
A: The redundancy execution circuit performs a bumpless rack switchover within a single logic scan, requiring approximately 3.133 ms to complete transfer.
Q: How many motion axes can the internal processor track simultaneously?
A: The Intel Celeron M 1 GHz processing core executes coordinated motion control algorithms for up to 64 axes while processing background logic tasks.
Field Installation Guidelines
- Chassis Insertion and Alignment: Align the modular PCB housing with the plastic guides of the PACSystems RX3i rack frame. Push the card horizontally until the rear connectors mate with the backplane bus, then secure the top and bottom screws to establish solid chassis ground continuity.
- Serial Interface Segregation: Route the RS-232/RS-485 communication paths through dedicated trays separate from high-current power cables. Terminate the overall cable screen layer directly at the cabinet master earth ground bar to avoid signal degradation from electromagnetic interference.
- Thermal Vent Clearances: Provide a minimum of 100 mm vertical clearance above and below the chassis assembly to allow natural convection airflow. Maintain an ambient environment between 0 deg C and 60 deg C during continuous operation to prevent thermal stress.