STARDOM FCN-500 CPU Module Yokogawa NFCP502-S05 S2
STARDOM FCN-500 CPU Module Yokogawa NFCP502-S05 S2
STARDOM FCN-500 CPU Module Yokogawa NFCP502-S05 S2
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STARDOM FCN-500 CPU Module Yokogawa NFCP502-S05 S2

  • Manufacturer: Yokogawa

  • Part Number: NFCP502-S05 S2

  • Condition:New with Original Package

  • Product Type: Yokogawa STARDOM

  • Country of Origin: Japan

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

Yokogawa NFCP502-S05 S2 CPU Module

The Yokogawa NFCP502-S05 S2, also cataloged as the NFCP502-S05 S2 CPU Module, operates as a dedicated hardware component for real-time logic execution and system management within STARDOM FCN-500 control networks.

Suffix Breakdown & Model Matrix

Model Description
NFCP502-S05 S2 Standard STARDOM FCN-500 CPU module with dual-core RISC architecture

Hardware Specifications

Parameter Specification
Model NFCP502-S05 S2
Brand Yokogawa
Origin Japan
Weight 0.35 kg
Dimensions 130 x 28 x 130 mm
Operating Temp -40 deg C to +70 deg C
Power Consumption Subject to system backplane load
Processor Dual-core 32-bit RISC, 800 MHz
RAM 256 MB
Flash Memory 1 GB (ECC-protected)
I/O Capacity 128 modules
Switchover Time <= 50 ms

Process Control and Communication Interfaces

The NFCP502-S05 S2 utilizes the Vnet/IP protocol to ensure deterministic data exchange across distributed control nodes. This module facilitates channel-to-channel isolation on the expansion bus to maintain signal integrity in electrically noisy industrial areas. In addition to standard control tasks, the CPU manages 4-20 mA HART loop data via peripheral I/O, enabling direct monitoring of field device diagnostics. Cold junction compensation (CJC) for temperature sensing is executed through the integrated I/O backplane coordination, ensuring precise thermal measurement processing.

Frequently Asked Questions

Q: Does the module support hot-swapping under full load conditions?

A: Yes. The module is designed for hot-swap operations, allowing replacement without interrupting the system I/O scan or requiring a controller shutdown.

Q: How does the module handle communication redundancy?

A: The processor utilizes four 10/100 Mbps Ethernet ports to support redundant network paths. In the event of a link failure, the controller switches to the secondary communication path within the specified fault transition timeframe.

Field Installation Guidelines

  1. Backplane Alignment: Ensure the backplane interface is clear of contaminants. Align the module vertically and engage the locking mechanisms to guarantee electrical contact with the system bus.
  2. Ambient Conditions: Verify that the operating environment remains within -40 deg C to +70 deg C. Provide sufficient vertical airflow to ensure the heat dissipation of the dual-core processor remains within nominal limits.
  3. Shielding and Grounding: Connect the module chassis to a dedicated earth ground. Ensure all I/O signal cabling uses high-quality shielding to maintain EMI/RFI immunity as per the module specification.
  4. Redundancy Setup: When deploying in a redundant CPU configuration, ensure both modules are synchronized via the dedicated link cable and are connected to isolated power supplies for maximum hardware fault tolerance.
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