TSX3710128DT1 Schneider Electric TSX Micro 37 Series Datasheet & Technical Manual

Schneider Electric TSX3710128DT1 Modicon TSX Micro 37 PLC Base Unit

The Schneider Electric TSX3710128DT1, also cataloged as the TSX3710128DT1 Modular PLC Base Unit, operates as a dedicated hardware component for high-speed discrete signal acquisition and transistor execution tasks within Modicon TSX Micro 37 control platforms.

Hardware Specifications

Profinet / EtherNet/IP Deterministic Networks and I/O Density Scaling

The TSX3710128DT1 provides high-density I/O density scaling by condensing 128 discrete channels directly into a 282.7 mm wide base frame. Three internal expansion tracks are positioned to receive supplementary sub-cards, which link directly to the central processing core via a parallel internal bus to maintain optimal backplane bus communication velocity metrics. Localized serial networks operate across the integrated Uni-Telway or Modbus RTU channels at 19.2 kbit/s. For modern control plant integration, these internal I/O registers interface with Profinet or EtherNet/IP deterministic networks through auxiliary communication gateways, translating the fast 1 kHz transistor transitions for downstream SCADA tracking.

Frequently Asked Questions

Q: How does the internal processor preserve application register states during a complete drop of the 24 VDC power supply?

A: The TSX3710128DT1 relies on an integrated lithium backup battery cell to maintain the 11,000-word volatile RAM workspace during a power drop. If auxiliary 24 VDC power is disconnected and the battery voltage falls below the functional threshold, the dynamic variables clear, requiring the system to retrieve the stable application structure from the 12,000-word non-volatile flash sector.

Q: Is hot-swapping permitted within the three available expansion slots while the 24 VDC supply line is active?

A: No. The Modicon TSX Micro 37 backplane tracking does not support hot-swapping features. Incoming 24 VDC power must be completely disconnected from the base assembly prior to extracting or inserting any expansion card to prevent electronic component damage or firmware flash compatibility errors.

Q: What protection measures exist to isolate the internal 24 VDC transistor outputs from field wiring short-circuits?

A: Each integrated source-type transistor output channel incorporates internal electronic overload and short-circuit protection circuits. When an external fault path draws current beyond the 0.5 A threshold, the protective gate shuts down the affected channel until the short-circuit condition is removed.

Field Installation Guidelines

• Chassis Alignment and Low-Impedance Earthing: Secure the 1.87 kg enclosure structure to a rigid metal sub-panel using the integrated chassis mounting points. Connect a short, thick copper braid from the primary PE ground lug directly to the enclosure main ground bar to divert transient high-frequency electrical noise.
• DC Input Voltage Regulation: Connect the incoming 24 VDC logic power supply through an isolated branch circuit breaker or inline current-limiting fuse. Verify voltage levels sit within the rated technical tolerances prior to turning on the motherboard.
• Transistor Inductive Arc Suppression: When wiring the 0.5 A fast transistor outputs to inductive loads such as solenoid coils or DC relay armatures, connect a freewheeling flyback diode directly across the load terminals to suppress inductive voltage kickback spikes.
• Convective Thermal Boundaries: Maintain a minimum 50 mm clearance perimeter above, below, and alongside the active base housing within the cabinet panel. Monitor ambient conditions to verify that the internal enclosure air stays within the specified 0 to 60 deg C operating limits.