TSXAEY420 Schneider Modicon Analog Input Module | New & Original Stock
TSXAEY420 Schneider Modicon Analog Input Module | New & Original Stock
TSXAEY420 Schneider Modicon Analog Input Module | New & Original Stock
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TSXAEY420 Schneider Modicon Analog Input Module | New & Original Stock

  • Manufacturer: Schneider

  • Part Number: TSXAEY420

  • Condition:New with Original Package

  • Product Type: Analog Input Modules

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

Schneider TSXAEY420 Modicon TSX Series 7 Analog Input Module

The Schneider TSXAEY420, also cataloged as the TSXAEY420 Analog Input Module, operates as a dedicated hardware component for converting industrial analog signals into high-resolution digital values within Modicon TSX Series 7 PLC platforms.

Hardware Specifications

Parameter Specification
Model TSXAEY420
Brand Schneider Electric
Origin France
Weight 0.33 kg
Dimensions Standard Modicon TSX Series 7 module format
Operating Temp 0 to 60 deg C
Storage Temp -25 to 70 deg C
Relative Humidity Operating: 10% to 95% non-condensing / Storage: 5% to 95% non-condensing
Power Supply 5 VDC via PLC backplane
Power Consumption Monitored internal backplane current draw
Number of Inputs 4 analog channels
Input Signal Type Current
Current Range 0 to 20 mA
Resolution 16-bit analog-to-digital conversion
Accuracy Plus/minus 0.1% typical
Isolation Channel-to-channel and channel-to-PLC isolation
Ingress Protection IP20
Operating Altitude Up to 2,000 m
Certifications IEC 1131, BV, LR, ABS, RINA, RMRS, GL, DNV
Lifecycle Status Discontinued legacy product

Industrial Control & I/O Density Scaling

The TSXAEY420 architecture incorporates true 16-bit conversion circuits matched to precise backplane bus communication velocity constraints. When implementing this module in dense Modicon TSX Series 7 rack layouts, managing external interference requires strict verification of the embedded channel-to-channel and channel-to-PLC isolation parameters. This galvanic separation prevents ground loop currents from shifting the internal reference voltage during concurrent 0 to 20 mA processing loops. Maintaining firmware flash compatibility across the host rack ensures that data packet transfers match the system scan times, preventing timing gaps during multi-channel execution.

Frequently Asked Questions

Q: How does the module handle signal drops below the standard 0 mA limit?

A: The integrated diagnostic logic continuously tracks input levels. If an input drop or loop disruption falls outside standard tolerances, the module flags a channel error code through the backplane bus to execute pre-defined PLC fallback actions.

Q: Is hot-swapping supported for the TSXAEY420 module on a live backplane?

A: No. Modicon TSX Series 7 systems require full power isolation before inserting or extracting any I/O module. Attempting live removal can cause transient damage to the 5 VDC logic bus pins and interrupt concurrent processing tasks.

Q: What are the installation restrictions for operating this hardware at high altitudes?

A: The module is certified for operation up to 2,000 m. Altitudes exceeding this limit reduce convective cooling efficiency due to lower air density, which can lower the effective maximum operating temperature ceiling below 60 deg C.

Field Installation Guidelines

  • Backplane Insertion and Seating: Guide the module straight along the rack tracks until the rear edge connector mates securely with the backplane terminal. Secure the mechanical locking mechanism fully to verify constant earth bonding.
  • Current Loop Termination and Shielding: Route all 0 to 20 mA instrument wiring using twisted-pair cables with an overall copper braid shield. Ground the shield at a single point on the master enclosure ground bar to prevent high-frequency noise from impacting the plus/minus 0.1% typical accuracy.
  • Environmental Panel Layout: Install the rack in a pollution degree 2 enclosure matching the TC protective treatment specifications. Keep at least 50 mm of open space around the module's vent slits to allow adequate thermal convection.
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