TSXAEZ801 Schneider Modicon TSX Micro Input Module | New Original Stock
Manufacturer: Schneider
-
Part Number: TSXAEZ801
Condition：New with Original Package
Product Type: Analog Input Modules
-
Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
Schneider TSXAEZ801 Modicon TSX Micro Analog Input Module
Configured for acquiring voltage signals from field devices and converting them into digital values for PLC processing, the Schneider TSXAEZ801 (TSXAEZ801 Analog Input Module) provides direct physical/electrical execution for eight independent instrument channels within Modicon TSX Micro Automation Platform racks.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | TSXAEZ801 |
| Brand | Schneider Electric |
| Origin | France |
| Weight | 0.5 kg |
| Dimensions | 5.5 cm x 18.0 cm x 26.0 cm (Package Dimensions) |
| Operating Temp | 0 to 60 deg C |
| Temperature Drift | 0.068% per 10 deg C |
| Power Consumption | 60 mA current consumption from the backplane |
| Number of Channels | 8 |
| Analog Input Type | 0 to 10 V |
| A/D Conversion Resolution | 11 bits + sign |
| Acquisition Period | 32 ms |
| Input Impedance | 2.2 Ohm |
| Isolation Voltage | 1000 V AC between inputs and system bus |
| Lifecycle Status | Legacy product |
Industrial Control & I/O Density Scaling
The internal circuitry of the TSXAEZ801 executes analog-to-digital data updates on a fixed 32 ms acquisition period. When optimizing I/O density scaling inside compact Modicon TSX Micro racks, processing these eight voltage lines requires strict attention to backplane bus communication velocity limits to prevent data collisions. Maintaining correct firmware flash compatibility across the host processor ensures that the 11-bit plus sign resolution registers update concurrently without dropping packets, stabilizing measurement repeatability across all 0 to 10 V signal loops.
Frequently Asked Questions
Q: How does the 2.2 Ohm input impedance parameter affect sensor matching?
A: The 2.2 Ohm input impedance profile is exceptionally low for a 0 to 10 V voltage module. Connected field transmitters must possess a low source impedance and high driving current capability to deliver stable signals into this channel structure without voltage drop or signal distortion.
Q: What are the isolation barriers between the input channels and the internal PLC logic?
A: The module incorporates a galvanic isolation layer rated for up to 1000 V AC. This boundary protects the internal 60 mA logic bus from high-voltage transient noise and common-mode spikes that may develop on the field instrumentation ground line.
Q: Is hot-swapping permitted for this module within the TSX Micro chassis?
A: No. Modicon TSX Micro hardware requires complete power isolation before extracting or executing the installation of any module component. Live insertion threatens the system bus data frames and can cause permanent component failure.
Field Installation Guidelines
- Chassis Engagement and Mechanical Locking: Slide the module completely into the assigned slot on the TSX Micro chassis. Verify that the rear connectors seat securely into the backplane, and hand-tighten any standard retention fasteners to establish solid grounding.
- Instrumentation Voltage Cable Shielding: Run all 0 to 10 V voltage lines inside dedicated low-voltage wire trays separated from heavy motor leads. Connect twisted-pair instrumentation wires with an overall braided shield, grounding the shield layer exclusively at the master enclosure ground rail.
- Thermal Mitigation Layout: Because temperature variations cause an accuracy drift of 0.068% per 10 deg C, maintain adequate convective airflow patterns around the module rack to prevent localized heat accumulation within the control cabinet.