{"product_id":"turbine-control-backbone-brand-new-is200bapah1agd-ge","title":"Turbine Control Backbone | Brand New IS200BAPAH1AGD GE","description":"\u003ch3\u003eProduct Overview\u003c\/h3\u003e\n\u003cp\u003eThe\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eGE IS200BAPAH1AGD\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e(BAPA) functions as the structural and electrical\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eBackplane Assembly Board\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003efor the\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eMark VI Speedtronic\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003econtrol system. This module provides the essential communication pathways, signal routing, and regulated power distribution required to interconnect multiple control cards within the rack. By acting as the high-speed backbone of the cabinet, the BAPA board ensures deterministic data exchange between processors and I\/O modules, maintaining system synchronization in gas and steam turbine applications.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eCondition:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e100% Brand New, Genuine OEM.\u003c\/p\u003e\n\u003ch3\u003eTechnical Specifications\u003c\/h3\u003e\n\u003cp\u003eThe IS200BAPAH1AGD utilizes a multi-layer PCB design with high-conductivity traces to ensure minimal signal attenuation and thermal stability.\u003c\/p\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr class=\"firstRow\"\u003e\n\u003ctd\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eManufacturer\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eGeneral Electric (GE)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eProduct Type\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eBackplane Assembly Board (BAPA)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eSystem Application\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eMark VI Turbine Control Systems\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eFunctional Revision\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eH1\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eArtwork Revision\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eAGD\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003ePrimary Function\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eInterconnection, Power Distribution, Signal Routing\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eInput Voltage\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e28 V DC Nominal\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eOutput Distribution\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003eMultiple regulated DC paths to child modules\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eOperating Temperature\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e0°C to +60°C (32°F to 140°F)\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eDimensions\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e215 × 154 × 30 mm\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cspan\u003e\u003cstrong\u003eWeight\u003c\/strong\u003e\u003c\/span\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cspan\u003e1.2 kg\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch3\u003eEngineering Advantages\u003c\/h3\u003e\n\u003cul class=\"list-paddingleft-2\"\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eDeterministic Interconnect Architecture:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eThe BAPA board eliminates external wiring complexity by providing hardwired signal paths on a high-integrity backplane. This architecture reduces the potential for signal jitter and latency, ensuring that the Mark VI processors receive real-time data from I\/O modules without interference.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eCentralized Power Management:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eThe board receives the primary 28V DC cabinet supply and distributes regulated power across the backplane bus. Integrated overvoltage and short-circuit protection safeguards every connected module, preventing a single card failure from compromising the entire rack’s power integrity.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eHigh-Bandwidth Signal Routing:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eSpecialized trace geometries maintain impedance control across the communication bus. This ensures reliable data transmission for high-speed turbine protection logic and complex excitation control sequences, even in environments with significant electromagnetic noise.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eMechanical Rigidity and Vibration Resistance:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eGE designed the IS200BAPAH1AGD to withstand the low-frequency vibrations typical of power generation halls. The heavy-duty connectors provide secure mechanical locking for all inserted modules, preventing intermittent contact issues during continuous industrial operation.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e\u003cstrong\u003eStreamlined Modular Integration:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eThe standardized mounting layout allows for rapid cabinet assembly and simplifies field upgrades. Because the backplane handles all primary routing, technicians can replace individual control cards without disturbing the underlying system wiring, significantly reducing Mean Time to Repair (MTTR).\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eFAQs\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eQ: Can the IS200BAPAH1AGD replace a BAPA board from a Mark VIe system?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eA: No. The IS200BAPAH1AGD is specifically designed for the\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eMark VI\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eInnovation series. While the Mark VIe uses similar backplane concepts, the connector pinouts and physical dimensions differ. Always verify the rack series in your system manual before installation.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eQ: Does this backplane require any software configuration or firmware?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eA: The BAPA board is a passive\/hardware-level interconnect assembly. It does not contain firmware; however, the modules plugged into it must be correctly configured in the GE control software (Toolbox) to recognize the specific slot addresses provided by the backplane.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eQ: How do I diagnose a potential backplane failure?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eA: Failure usually manifests as multiple module communication losses or localized power failures across a specific section of the rack. Use a multimeter to verify the 28V DC rail at the backplane test points. If power is present but modules fail to communicate despite being healthy, inspect the backplane pins for physical damage or contamination.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eQ: What is the significance of the \"AGD\" artwork revision?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003eA: The \"AGD\" suffix denotes a specific revision of the PCB artwork. This revision typically incorporates improved trace routing or component footprints designed to enhance noise immunity and thermal performance compared to earlier \"A\" or \"AB\" versions. It remains backward compatible with standard H1 functional revision requirements.\u003c\/p\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":44092730703971,"sku":"IS200BAPAH1AGD","price":177.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0583\/5246\/8067\/files\/452._0ff91c42-07eb-4c67-bbc2-8b14706d151f.jpg?v=1774950794","url":"https:\/\/www.autocontrolglobal.com\/products\/turbine-control-backbone-brand-new-is200bapah1agd-ge","provider":"AutoControl Global","version":"1.0","type":"link"}