{"product_id":"ur9kh-ge-multilin-universal-relay-series-datasheet-technical-manual","title":"UR9KH GE Multilin Universal Relay Series Datasheet \u0026 Technical Manual","description":"\u003ch2\u003eGE Multilin UR9KH Universal Relay Series CPU Module\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eGE Multilin UR9KH\u003c\/strong\u003e serves as the primary \u003cstrong\u003eUR9KH\u003c\/strong\u003e CPU Module utilized to execute protection and control algorithms across GE Multilin UR Series platforms. The hardware processes high-speed arithmetic logical operations, synchronizes discrete sub-module scan periods, and sequences local fault logic loops based on configured protective setpoints. It acts as the central execution engine responsible for managing real-time data acquisition buffers, sequential event logs, and oscillography disturbance registers recorded via upstream instrument transformer sensor arrays.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eUR9KH\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Multilin\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eCanada\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.75 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard UR chassis module size (6 x 4 in)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e-40 to 70 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003eInternally derived via UR series backplane infrastructure\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProcessor Type\u003c\/td\u003e\n\u003ctd\u003eEmbedded microprocessor architecture\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVolatile Storage\u003c\/td\u003e\n\u003ctd\u003eOn-board RAM array\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eNon-Volatile Storage\u003c\/td\u003e\n\u003ctd\u003eIntegrated flash memory matrix\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCore Protocols\u003c\/td\u003e\n\u003ctd\u003eModbus, DNP3, IEC 61850\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInter-Module Interface\u003c\/td\u003e\n\u003ctd\u003eHigh-speed internal backplane data channel\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStorage Temperature\u003c\/td\u003e\n\u003ctd\u003e-40 to 85 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eSuffix Breakdown \u0026amp; Model Matrix\u003c\/h3\u003e\n\u003cp\u003eThe UR9KH coding matrix governs the exact hardware revision and option assignment for the UR series processing assembly.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eUR:\u003c\/strong\u003e Universal Relay Series platform foundation prefix.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e9K:\u003c\/strong\u003e Standard processing configuration identifier for generation-three logic engines.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eH:\u003c\/strong\u003e High-performance hardware processing core revision variant block.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eProfinet \/ EtherNet\/IP Deterministic Networks and I\/O Density Scaling\u003c\/h3\u003e\n\u003cp\u003eThe UR9KH logic engine dictates the baseline backplane bus communication velocity across adjacent sampling slots. When system frameworks undergo extensive I\/O density scaling routines, the central processor schedules local bus priorities to transmit time-critical packets to upstream Profinet or EtherNet\/IP deterministic networks without delaying core math operations. The design enforces strict firmware flash compatibility verification routines between the central processing chip and auxiliary card components, locking scan cycle precision down to deterministic sub-millisecond intervals during structural grid events.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003e\u003cstrong\u003eQ: Can the UR9KH CPU module be pulled out of the Universal Relay chassis while the system is actively monitoring field components?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eA: No.\u003c\/strong\u003e Removing the module breaks the internal backplane bus data lines and cuts off processor power. This action disables all background protective loops, freezes any pending trip output matrices, and results in a total node outage that requires manual initialization.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eQ: How does the UR9KH manage memory stability if a complete sub-station auxiliary DC power dropout occurs?\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eA: The module relies on non-volatile, on-board flash memory arrays.\u003c\/strong\u003e All configuration parameters, local FlexLogic equations, and calibration constants are committed directly to solid-state storage sectors, preserving data maps without using any internal battery backup cells.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eAnti-Static Frame Grounding:\u003c\/strong\u003e Ensure all auxiliary power feeds are disconnected from the rack frame before slot maintenance. Operators must hook up a static-dissipative wrist strap to a verified enclosure chassis grounding point before handling the 0.75 kg module card structure.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBackplane Insertion Velocity:\u003c\/strong\u003e Align the top and bottom edge tracks of the printed circuit board smoothly within the designated chassis chamber. Slide the card backward with firm, continuous pressure until the multi-pin connector snaps fully into the active backplane socket.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFirmware Step Synchronization:\u003c\/strong\u003e Verify that the existing sub-module cards in the rack share matching firmware flash compatibility layers before powering on the slot. Mismatched firmware builds will flag a diagnostic boot fault on the front display panel.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eData Interface Path Isolation:\u003c\/strong\u003e Route external communication lines running from the card to local network switches separate from any high-voltage transformer secondary connections to shield the processor from electromagnetic noise spikes.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":43863078043747,"sku":"UR9KH","price":120.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0583\/5246\/8067\/files\/183.1_32a26e0f-bf9f-4b43-a748-1acd51ce196c.jpg?v=1764319582","url":"https:\/\/www.autocontrolglobal.com\/products\/ur9kh-ge-multilin-universal-relay-series-datasheet-technical-manual","provider":"AutoControl Global","version":"1.0","type":"link"}