VE4050S2K1C0 Emerson 8-Wide I/O Interface Carrier | New Stock
Manufacturer: Emerson
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Part Number: VE4050S2K1C0
Condition：New with Original Package
Product Type: I/O Interface Carriers
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
Emerson VE4050S2K1C0 DeltaV M-Series
Configured for Specific Technical Task in System/Network Name, the Emerson VE4050S2K1C0 (VE4050S2K1C0 I/O Interface Carrier) provides direct physical/electrical execution. It functions as an 8-wide structural and electrical mounting backplane that distributes power and establishes the communication path between 8 local I/O modules and the DeltaV M-Series controller backplane.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | VE4050S2K1C0 |
| Brand | Emerson |
| Origin | USA |
| Weight | 0.9 kg |
| Dimensions | Factory Standard |
| Operating Temp | -40 to +70 deg C |
| Power Consumption | 8 A Maximum Current Capacity |
| Order Number | KJ4001X1-BB1 |
| Part Number | 12P0818X072 |
| Type | I/O Interface Carrier |
| Series | DeltaV M-Series |
| I/O Width | 8-wide |
| Carrier Features | Integrated shield bar for signal protection |
| Category | PLCs / Machine Control |
| Subcategory | VDC Logic I/O Module |
Process Control & DCS Instrumentation Properties
The electrical backbone of the VE4050S2K1C0 uses an integrated structural shield bar to provide channel-to-channel isolation and protect low-level signal traces from high-frequency electromagnetic interference. By establishing continuous ground planes across the 8 module slots, the carrier maintains signal path fidelity and loop impedance bounds required for 4-20 mA HART loop protocol pass-through telemetry. This grounding architecture suppresses common-mode voltage noise and prevents cross-talk across parallel field wiring connections during high-density data execution.
Frequently Asked Questions
Q: What are the current distribution limitations when powering 8 high-density modules on this carrier?
A: The carrier backplane traces are engineered for a maximum current limit of 8 A. The combined power draw of all 8 installed I/O modules and their associated field circuits must not exceed this 8 A threshold to prevent thermal stress on the internal bus lines.
Q: Does the carrier backplane support hot-swapping of modules, and what is the effect on the remaining channels?
A: Yes, the hardware backplane allows live hot-swapping of individual M-Series I/O modules. Removing a module breaks the electrical link for that specific slot instantly but does not interrupt the 12 VDC LocalBus or power distribution lines feeding adjacent slots.
Field Installation Guidelines
- Mounting Orientation and Alignment: Secure the carrier vertically onto a flat surface or standard mounting plate inside the enclosure. Ensure all interlocking alignment tabs are properly seated before anchoring the structural fasteners to prevent bus connection stress.
- Shield Bar Termination: Connect all field cable drain wires directly to the integrated carrier shield bar. The shield bar must have a low-impedance connection to the central enclosure instrument earth point to ensure proper noise attenuation.
- Thermal Spacing Layout: Maintain standard clearances above and below the 8-wide carrier block. This spacing allows unobstructed air convection across the installed modules, keeping the assembly within its -40 to +70 deg C operating parameters.
- Field Power Separation: Route all high-voltage AC distribution lines through separate wire trunks isolated from the low-voltage DC signals entering the carrier terminals to prevent capacitive noise coupling.