Product Description

Overview

The GE Fanuc IC694DNM200‑BB is a high-performance DeviceNet Master communication module for PACSystems RX3i PLCs. It enables deterministic, high-speed communication with up to 63 DeviceNet field devices. Moreover, its rugged design ensures reliable operation in industrial environments.

Technical Specifications

Network Role
• DeviceNet Master module
• Supports up to 63 DeviceNet slave devices

Compatibility
• RX3i CPUs: IC695CPU310 (firmware v3.5+)
• Series 90‑30 CPUs: All except IC693CPU321/IC693CPU340 (firmware v8.0+, v10 recommended)

Communication Speed
• Supports 125 kbps, 250 kbps, and 500 kbps baud rates
• High-speed patented throughput optimization

Network Interface
• DeviceNet connector for trunk/drop cabling
• Multi-drop topology support

Diagnostics & Monitoring
• Network health monitoring
• Device status reporting
• Fault detection to RX3i CPU

Power Requirements
• 24 VDC input for DeviceNet network power
• Module powered via RX3i rack backplane

Physical Specifications
• Standard RX3i rack-mounted module
• Single-slot width
• Dimensions: 1.5 × 5.3 × 5.5 in (3.8 × 13.5 × 14.0 cm)
• Weight: 0.4 kg

Environmental Ratings
• Operating temperature: 0 °C to +60 °C
• Storage temperature: –40 °C to +85 °C
• Humidity: 5–95% non-condensing

FAQ (Plain Text Format)

Q1: What is the maximum number of DeviceNet devices supported?
A: The module supports up to 63 DeviceNet slave devices.

Q2: Which PLCs are compatible with IC694DNM200-BB?
A: Compatible with RX3i CPUs (IC695CPU310, firmware v3.5+) and most Series 90‑30 CPUs.

Q3: What communication speeds are supported?
A: Supports 125 kbps, 250 kbps, and 500 kbps DeviceNet baud rates.

Q4: How does the module handle diagnostics?
A: Provides network health monitoring, device status reporting, and fault detection to the RX3i CPU.

Q5: Can it operate in harsh environments?
A: Yes, it operates from 0 °C to +60 °C and can be stored from –40 °C to +85 °C with 5–95% humidity.